发明授权
- 专利标题： Semiconductor chip-embedded substrate and method of manufacturing same
- 专利标题（中）： 半导体芯片嵌入式基板及其制造方法
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申请号： US11188322申请日： 2005-07-25
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公开(公告)号： US07501696B2公开(公告)日： 2009-03-10
- 发明人: Tetsuya Koyama , Tsuyoshi Kobayashi
- 申请人： Tetsuya Koyama , Tsuyoshi Kobayashi
- 申请人地址： JP Nagano
- 专利权人： Shinko Electric Industries Co., Ltd.
- 当前专利权人： Shinko Electric Industries Co., Ltd.
- 当前专利权人地址： JP Nagano
- 代理机构： Paul & Paul
- 优先权： JP2004-223293 20040730
- 主分类号： H01L21/70
- IPC分类号： H01L21/70 ; H01L23/12
摘要：
A semiconductor chip-embedded substrate comprising a supporting substrate and an insulating layer thereon, members for the connection to external circuits, and a plurality of semiconductor chips embedded in the insulating layer, wherein at least some of the plurality of semiconductor chips are embedded as a stack or stacks thereof. A method of manufacturing such a semiconductor chip-embedded substrate is also disclosed.
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