发明授权
US07514273B2 Method for applying rewiring to a panel while compensating for position errors of semiconductor chips in component positions of the panel
失效
在面板的组件位置补偿半导体芯片的位置误差的同时向面板施加重新布线的方法
- 专利标题： Method for applying rewiring to a panel while compensating for position errors of semiconductor chips in component positions of the panel
- 专利标题（中）： 在面板的组件位置补偿半导体芯片的位置误差的同时向面板施加重新布线的方法
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申请号： US10566454申请日： 2004-06-28
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公开(公告)号： US07514273B2公开(公告)日： 2009-04-07
- 发明人: Harry Hedler , Jens Pohl , Holger Woerner
- 申请人： Harry Hedler , Jens Pohl , Holger Woerner
- 申请人地址： DE Munich
- 专利权人： Qimonda AG
- 当前专利权人： Qimonda AG
- 当前专利权人地址： DE Munich
- 代理机构： Dicke, Billig, Czaja, PLLC
- 优先权： DE10334577 20030728
- 国际申请： PCT/DE2004/001360 WO 20040628
- 国际公布： WO2005/015634 WO 20050217
- 主分类号： H01L21/20
- IPC分类号： H01L21/20
摘要：
The invention relates to a method for applying rewiring to a panel. For this purpose, a panel is provided which has a coplanar overall upper side of an upper side of a plastic compound and the upper sides of semiconductor chips. The method provides a rewiring layer with implementation of external contacts and rewiring lines which, by means of a two-stage exposure step, compensates for position errors of the semiconductor chips in the component positions of the panel.
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