发明授权
- 专利标题: Wafer bevel particle detection
- 专利标题(中): 晶圆斜角粒子检测
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申请号: US11412058申请日: 2006-04-25
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公开(公告)号: US07521915B2公开(公告)日: 2009-04-21
- 发明人: Harald Herchen , Christopher L. Beaudry
- 申请人: Harald Herchen , Christopher L. Beaudry
- 申请人地址: JP Kyoto
- 专利权人: Sokudo Co., Ltd.
- 当前专利权人: Sokudo Co., Ltd.
- 当前专利权人地址: JP Kyoto
- 代理机构: Townsend and Townsend and Crew LLP
- 主分类号: G01R31/28
- IPC分类号: G01R31/28
摘要:
An apparatus adapted to detect a particle present on a bevel of a wafer. The apparatus includes a substrate support and a sensor housing adapted to receive an edge of the wafer. The sensor housing includes one or more probe electrodes and one or more position sensors. The apparatus also includes a translatable stage coupled to the sensor housing. The translatable stage is adapted to control the distance between the bevel of the wafer and the one or more position sensors. The apparatus further includes electrical circuitry electrically coupled to the substrate support and the one or more probe electrodes and adapted to generate an electric field between the bevel of the wafer and the one or more probe electrodes, detection circuitry electrically coupled to the electrical circuitry, and a processor adapted to process electrical signals and thereby detect the particle present on the bevel of the wafer.
公开/授权文献
- US20070247137A1 Wafer bevel particle detection 公开/授权日:2007-10-25
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