发明授权
US07528944B2 Methods and systems for detecting pinholes in a film formed on a wafer or for monitoring a thermal process tool
有权
用于检测在晶片上形成的膜中的针孔或用于监测热处理工具的方法和系统
- 专利标题： Methods and systems for detecting pinholes in a film formed on a wafer or for monitoring a thermal process tool
- 专利标题（中）： 用于检测在晶片上形成的膜中的针孔或用于监测热处理工具的方法和系统
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申请号： US11751970申请日： 2007-05-22
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公开(公告)号： US07528944B2公开(公告)日： 2009-05-05
- 发明人: David Chen , Andrew Steinbach , Daniel Kavaldjiev , Alexander Belyaev , Juergen Reich
- 申请人： David Chen , Andrew Steinbach , Daniel Kavaldjiev , Alexander Belyaev , Juergen Reich
- 申请人地址： US CA Milpitas
- 专利权人： KLA-Tencor Technologies Corporation
- 当前专利权人： KLA-Tencor Technologies Corporation
- 当前专利权人地址： US CA Milpitas
- 代理机构： Baker & McKenzie LLP
- 主分类号： G01N21/00
- IPC分类号： G01N21/00
摘要：
Methods and systems for detecting pinholes in a film formed on a wafer or for monitoring a thermal process tool are provided. One method for detecting pinholes in a film formed on a wafer includes generating output responsive to light from the wafer using an inspection system. The output includes first output corresponding to defects on the wafer and second output that does not correspond to the defects. This method also includes detecting the pinholes in the film formed on the wafer using the second output. One method for monitoring a thermal process tool includes generating output responsive to light from a wafer using an inspection system. The output includes the first and second output described above. The wafer was processed by the thermal process tool prior to generating the output. The method also includes monitoring the thermal process tool using the second output.
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