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    Methods and systems for detecting pinholes in a film formed on a wafer or for monitoring a thermal process tool
    1.
    发明授权
    Methods and systems for detecting pinholes in a film formed on a wafer or for monitoring a thermal process tool 有权
    用于检测在晶片上形成的膜中的针孔或用于监测热处理工具的方法和系统

    公开(公告)号：US07528944B2

    公开(公告)日：2009-05-05

    申请号：US11751970

    申请日：2007-05-22

    申请人： David Chen ,  Andrew Steinbach ,  Daniel Kavaldjiev ,  Alexander Belyaev ,  Juergen Reich

    发明人： David Chen ,  Andrew Steinbach ,  Daniel Kavaldjiev ,  Alexander Belyaev ,  Juergen Reich

    IPC分类号： G01N21/00

    CPC分类号： G01N21/894 ,  G01N21/47 ,  G01N21/55 ,  G01N21/9501 ,  G01N21/956 ,  G01N2021/4735 ,  G01N2021/8822 ,  G03F7/7065

    摘要： Methods and systems for detecting pinholes in a film formed on a wafer or for monitoring a thermal process tool are provided. One method for detecting pinholes in a film formed on a wafer includes generating output responsive to light from the wafer using an inspection system. The output includes first output corresponding to defects on the wafer and second output that does not correspond to the defects. This method also includes detecting the pinholes in the film formed on the wafer using the second output. One method for monitoring a thermal process tool includes generating output responsive to light from a wafer using an inspection system. The output includes the first and second output described above. The wafer was processed by the thermal process tool prior to generating the output. The method also includes monitoring the thermal process tool using the second output.

    摘要翻译： 提供了用于检测在晶片上形成的膜中的针孔或用于监测热处理工具的方法和系统。 用于检测形成在晶片上的膜中的针孔的一种方法包括使用检查系统响应于来自晶片的光而产生输出。 输出包括对应于晶片上的缺陷的第一输出和不对应于缺陷的第二输出。 该方法还包括使用第二输出来检测在晶片上形成的膜中的针孔。 用于监测热处理工具的一种方法包括响应来自使用检查系统的晶片的光产生输出。 输出包括上述第一和第二输出。 在生成输出之前，通过热处理工具处理晶片。 该方法还包括使用第二输出来监测热处理工具。

    METHODS AND SYSTEMS FOR DETECTING PINHOLES IN A FILM FORMED ON A WAFER OR FOR MONITORING A THERMAL PROCESS TOOL
    2.
    发明申请
    METHODS AND SYSTEMS FOR DETECTING PINHOLES IN A FILM FORMED ON A WAFER OR FOR MONITORING A THERMAL PROCESS TOOL 有权
    用于检测形成在膜上的薄膜或用于监测热过程工具的方法和系统

    公开(公告)号：US20080018887A1

    公开(公告)日：2008-01-24

    申请号：US11751970

    申请日：2007-05-22

    申请人： David Chen ,  Andrew Steinbach ,  Daniel Kavaldjiev ,  Alexander Belyaev ,  Juergen Reich

    发明人： David Chen ,  Andrew Steinbach ,  Daniel Kavaldjiev ,  Alexander Belyaev ,  Juergen Reich

    IPC分类号： G01N21/00

    CPC分类号： G01N21/894 ,  G01N21/47 ,  G01N21/55 ,  G01N21/9501 ,  G01N21/956 ,  G01N2021/4735 ,  G01N2021/8822 ,  G03F7/7065

    摘要： Methods and systems for detecting pinholes in a film formed on a wafer or for monitoring a thermal process tool are provided. One method for detecting pinholes in a film formed on a wafer includes generating output responsive to light from the wafer using an inspection system. The output includes first output corresponding to defects on the wafer and second output that does not correspond to the defects. This method also includes detecting the pinholes in the film formed on the wafer using the second output. One method for monitoring a thermal process tool includes generating output responsive to light from a wafer using an inspection system. The output includes the first and second output described above. The wafer was processed by the thermal process tool prior to generating the output. The method also includes monitoring the thermal process tool using the second output.

    摘要翻译： 提供了用于检测在晶片上形成的膜中的针孔或用于监测热处理工具的方法和系统。 用于检测形成在晶片上的膜中的针孔的一种方法包括使用检查系统响应来自晶片的光产生输出。 输出包括对应于晶片上的缺陷的第一输出和不对应于缺陷的第二输出。 该方法还包括使用第二输出来检测在晶片上形成的膜中的针孔。 用于监测热处理工具的一种方法包括响应来自使用检查系统的晶片的光产生输出。 输出包括上述第一和第二输出。 在生成输出之前，通过热处理工具处理晶片。 该方法还包括使用第二输出来监测热处理工具。

    COMPUTER-IMPLEMENTED METHODS FOR INSPECTING AND/OR CLASSIFYING A WAFER
    3.
    发明申请
    COMPUTER-IMPLEMENTED METHODS FOR INSPECTING AND/OR CLASSIFYING A WAFER 有权
    用于检查和/或分类WAFER的计算机实现方法

    公开(公告)号：US20100060888A1

    公开(公告)日：2010-03-11

    申请号：US12179260

    申请日：2008-07-24

    申请人： Juergen Reich ,  Louis Vintro ,  Prasanna Dighe ,  Andrew Steinbach ,  Daniel Kavaldjiev ,  Stephen Biellak

    发明人： Juergen Reich ,  Louis Vintro ,  Prasanna Dighe ,  Andrew Steinbach ,  Daniel Kavaldjiev ,  Stephen Biellak

    IPC分类号： G01N21/88 ,  B07C5/02

    CPC分类号： H01L22/12 ,  G01N21/9501 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Computer-implemented methods for inspecting and/or classifying a wafer are provided. One computer-implemented includes detecting defects on a wafer using one or more defect detection parameters, which are determined based on a non-spatially localized characteristic of the wafer that is determined using output responsive to light scattered from the wafer generated by an inspection system. Another computer-implemented method includes classifying a wafer based on a combination of a non-spatially localized characteristic of the wafer determined using output responsive to light scattered from the wafer generated by an inspection system and a spatially localized characteristic of the wafer determined using the output.

    摘要翻译： 提供了用于检查和/或分类晶片的计算机实现的方法。 一种计算机实现的包括使用一个或多个缺陷检测参数来检测晶片上的缺陷，所述缺陷检测参数是基于使用响应于由检查系统产生的晶片散射的光的输出而确定的晶片的非空间局部特征确定的。 另一种计算机实现的方法包括基于使用响应于由检查系统产生的晶片散射的光的输出确定的晶片的非空间局部化特性和使用输出确定的晶片的空间局部化特性的组合来分类晶片 。

    Computer-implemented methods for inspecting and/or classifying a wafer
    4.
    发明授权
    Computer-implemented methods for inspecting and/or classifying a wafer 有权
    用于检查和/或分类晶片的计算机实现的方法

    公开(公告)号：US08269960B2

    公开(公告)日：2012-09-18

    申请号：US12179260

    申请日：2008-07-24

    申请人： Juergen Reich ,  Louis Vintro ,  Prasanna Dighe ,  Andrew Steinbach ,  Daniel Kavaldjiev ,  Stephen Biellak

    发明人： Juergen Reich ,  Louis Vintro ,  Prasanna Dighe ,  Andrew Steinbach ,  Daniel Kavaldjiev ,  Stephen Biellak

    IPC分类号： G01N21/00

    CPC分类号： H01L22/12 ,  G01N21/9501 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Computer-implemented methods for inspecting and/or classifying a wafer are provided. One computer-implemented includes detecting defects on a wafer using one or more defect detection parameters, which are determined based on a non-spatially localized characteristic of the wafer that is determined using output responsive to light scattered from the wafer generated by an inspection system. Another computer-implemented method includes classifying a wafer based on a combination of a non-spatially localized characteristic of the wafer determined using output responsive to light scattered from the wafer generated by an inspection system and a spatially localized characteristic of the wafer determined using the output.

    摘要翻译： 提供了用于检查和/或分类晶片的计算机实现的方法。 一种计算机实现的包括使用一个或多个缺陷检测参数来检测晶片上的缺陷，所述缺陷检测参数是基于使用响应于由检查系统产生的晶片散射的光的输出而确定的晶片的非空间局部特征确定的。 另一种计算机实现的方法包括基于使用响应于由检查系统产生的晶片散射的光的输出确定的晶片的非空间局部化特性和使用输出确定的晶片的空间局部化特性的组合来分类晶片 。

    Computer-implemented methods and systems for determining a configuration for a light scattering inspection system
    5.
    发明授权
    Computer-implemented methods and systems for determining a configuration for a light scattering inspection system 有权
    用于确定光散射检查系统的配置的计算机实现的方法和系统

    公开(公告)号：US07436505B2

    公开(公告)日：2008-10-14

    申请号：US11278624

    申请日：2006-04-04

    申请人： Alexander Belyaev ,  Daniel Kavaldjiev ,  Amith Murali ,  Aleksey Petrenko ,  Mike D. Kirk ,  David Shortt ,  Brian L. Haas ,  Kurt L. Haller

    发明人： Alexander Belyaev ,  Daniel Kavaldjiev ,  Amith Murali ,  Aleksey Petrenko ,  Mike D. Kirk ,  David Shortt ,  Brian L. Haas ,  Kurt L. Haller

    IPC分类号： G01N21/00

    CPC分类号： G01N21/9501

    摘要： Computer-implemented methods and systems for determining a configuration for a light scattering inspection system are provided. One computer-implemented method includes determining a three-dimensional map of signal-to-noise ratio values for data that would be acquired for a specimen and a potential defect on the specimen by the light scattering inspection system across a scattering hemisphere of the inspection system. The method also includes determining one or more portions of the scattering hemisphere in which the signal-to-noise ratio values are higher than in other portions of the scattering hemisphere based on the three-dimensional map. In addition, the method includes determining a configuration for a detection subsystem of the inspection system based on the one or more portions of the scattering hemisphere.

    摘要翻译： 提供了用于确定光散射检查系统的配置的计算机实现的方法和系统。 一种计算机实现的方法包括：通过在检查系统的散射半球上的光散射检查系统来确定用于样本获取的数据和样本上的潜在缺陷的信噪比值的三维图 。 该方法还包括基于三维图确定散射半球的一个或多个部分，其中信噪比值高于散射半球的其它部分。 此外，该方法包括基于散射半球的一个或多个部分来确定检查系统的检测子系统的配置。

    Computer-Implemented Methods and Systems for Determining a Configuration for a Light Scattering Inspection System
    6.
    发明申请
    Computer-Implemented Methods and Systems for Determining a Configuration for a Light Scattering Inspection System 有权
    用于确定光散射检查系统的配置的计算机实现的方法和系统

    公开(公告)号：US20070229809A1

    公开(公告)日：2007-10-04

    申请号：US11278624

    申请日：2006-04-04

    申请人： Alexander Belyaev ,  Daniel Kavaldjiev ,  Amith Murali ,  Aleksey Petrenko ,  Mike Kirk ,  David Shortt ,  Brian Haas ,  Kurt Haller

    发明人： Alexander Belyaev ,  Daniel Kavaldjiev ,  Amith Murali ,  Aleksey Petrenko ,  Mike Kirk ,  David Shortt ,  Brian Haas ,  Kurt Haller

    IPC分类号： G01N21/88

    CPC分类号： G01N21/9501

    摘要： Computer-implemented methods and systems for determining a configuration for a light scattering inspection system are provided. One computer-implemented method includes determining a three-dimensional map of signal-to-noise ratio values for data that would be acquired for a specimen and a potential defect on the specimen by the light scattering inspection system across a scattering hemisphere of the inspection system. The method also includes determining one or more portions of the scattering hemisphere in which the signal-to-noise ratio values are higher than in other portions of the scattering hemisphere based on the three-dimensional map. In addition, the method includes determining a configuration for a detection subsystem of the inspection system based on the one or more portions of the scattering hemisphere.

    摘要翻译： 提供了用于确定光散射检查系统的配置的计算机实现的方法和系统。 一种计算机实现的方法包括：通过在检查系统的散射半球上的光散射检查系统来确定用于样本获取的数据和样本上的潜在缺陷的信噪比值的三维图 。 该方法还包括基于三维图确定散射半球的一个或多个部分，其中信噪比值高于散射半球的其它部分。 此外，该方法包括基于散射半球的一个或多个部分来确定检查系统的检测子系统的配置。

    Reduced coherence symmetric grazing incidence differential interferometer
    9.
    发明授权
    Reduced coherence symmetric grazing incidence differential interferometer 有权
    减少相干对称掠入射差分干涉仪

    公开(公告)号：US07173715B2

    公开(公告)日：2007-02-06

    申请号：US11157341

    申请日：2005-07-12

    申请人： Dieter Mueller ,  Rainer Schierle ,  Daniel Kavaldjiev

    发明人： Dieter Mueller ,  Rainer Schierle ,  Daniel Kavaldjiev

    IPC分类号： G01B9/02

    CPC分类号： G01B11/06 ,  G01B9/02021 ,  G01B9/02072 ,  G01B9/0209 ,  G01B11/0675 ,  G01B2210/56 ,  G01B2290/30 ,  G01N21/9501

    摘要： A system for inspecting specimens such as semiconductor wafers is provided. The system provides scanning of dual-sided specimens using a diffraction grating that widens and passes nth order (n>0) wave fronts to the specimen surface and a reflective surface for each channel of the light beam. Two channels and two reflective surfaces are preferably employed, and the wavefronts are combined using a second diffraction grating and passed to a camera system having a desired aspect ratio. The system preferably comprises a damping arrangement which filters unwanted acoustic and seismic vibration, including an optics arrangement which scans a first portion of the specimen and a translation or rotation arrangement for translating or rotating the specimen to a position where the optics arrangement can scan the remaining portion(s) of the specimen. The system further includes means for stitching scans together, providing for smaller and less expensive optical elements.

    摘要翻译： 提供了用于检查诸如半导体晶片的样本的系统。 该系统使用衍射光栅扫描双面样品，该衍射光栅将第n阶（n> 0）波阵面扩大并通过到样品表面，以及光束每个通道的反射表面。 优选地使用两个通道和两个反射表面，并且使用第二衍射光栅将波前组合并传递到具有期望的纵横比的相机系统。 该系统优选地包括滤波不需要的声波和地震振动的阻尼装置，包括扫描样本的第一部分的光学装置和用于将样本平移或旋转到平行或旋转装置的位置，其中光学装置可以扫描剩余的 样本的一部分。 该系统还包括用于将扫描拼接在一起的装置，为更小且更便宜的光学元件提供。