发明授权
- 专利标题: Electrolytic processing method
- 专利标题(中): 电解加工方法
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申请号: US10948320申请日: 2004-09-24
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公开(公告)号: US07578920B2公开(公告)日: 2009-08-25
- 发明人: Ikutaro Noji , Hozumi Yasuda , Takeshi Iizumi , Kazuto Hirokawa , Itsuki Kobata
- 申请人: Ikutaro Noji , Hozumi Yasuda , Takeshi Iizumi , Kazuto Hirokawa , Itsuki Kobata
- 申请人地址: JP Tokyo
- 专利权人: Ebara Corporation
- 当前专利权人: Ebara Corporation
- 当前专利权人地址: JP Tokyo
- 代理机构: Wenderoth, Lind & Ponack, L.L.P.
- 优先权: JP2003-336327 20030926
- 主分类号: C25D21/12
- IPC分类号: C25D21/12 ; C25F3/02
摘要:
An electrolytic processing apparatus can detect the end point of electrolytic processing stably with high precision and with a relatively simple construction. The electrolytic processing apparatus includes: a processing electrode which can come close to or into contact with a processing object; a feeding electrode for feeding electricity to the processing object; a fluid supply section for supplying fluid between the processing object and at least one of the processing electrode and the feeding electrode; a processing power source for applying a voltage between the processing electrode and the feeding electrode; a drive section for causing relative movement between the processing object and at least one of the processing electrode and the feeding electrode; and an eddy current sensor for detecting the thickness of the processing object from a change in eddy current loss. The sensor is disposed not in contact with (or separately) by an insulator from the processing electrode and/or the feeding electrode.
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