公开(公告)号：US20070187257A1

公开(公告)日：2007-08-16

申请号：US10592673

申请日：2005-03-16

申请人： Ikutaro Noji ,  Hozumi Yasuda ,  Takeshi Iizumi ,  Itsuki Kobata ,  Kazuto Hirokawa ,  Takayuki Saito ,  Tsukuru Suzuki ,  Yasushi Toma ,  Akira Kodera

发明人： Ikutaro Noji ,  Hozumi Yasuda ,  Takeshi Iizumi ,  Itsuki Kobata ,  Kazuto Hirokawa ,  Takayuki Saito ,  Tsukuru Suzuki ,  Yasushi Toma ,  Akira Kodera

IPC分类号： B23H7/00

CPC分类号： B24B37/04 ,  B23H5/08 ,  B24B53/017 ,  C25F3/02 ,  C25F7/00 ,  H01L21/32125

摘要： An electrolytic processing apparatus can maintain a difference in electric resistance between a recessed portion and a raised portion in the surface of a workpiece, thereby providing a processed surface with improved flatness. The electrolytic processing apparatus including: a processing electrode capable of bringing into contact with or closing to a workpiece; a feeding electrode for feeding electricity to the workpiece; a contact member disposed between the workpiece and at least one of the processing electrode and the feeding electrode, the degree of deformation of said contact member by a contact load applied from the workpiece being smal

摘要翻译： 电解处理装置可以保持工件表面中的凹部和凸起部之间的电阻差，从而提供具有改善的平坦度的加工表面。 电解处理装置包括：能够与工件接触或闭合的处理电极; 用于向工件供电的供电电极; 设置在工件与处理电极和供电电极中的至少一个之间的接触构件，通过从工件施加的接触载荷为微小的所述接触构件的变形程度为小

公开(公告)号：US20070272562A1

公开(公告)日：2007-11-29

申请号：US10560623

申请日：2004-07-14

申请人： Ikutaro Noji ,  Hozumi Yasuda ,  Takeshi Iizumi ,  Kazuto Hirokawa ,  Itsuki Kobata

发明人： Ikutaro Noji ,  Hozumi Yasuda ,  Takeshi Iizumi ,  Kazuto Hirokawa ,  Itsuki Kobata

IPC分类号： H01L21/3063

CPC分类号： C25F3/00 ,  C25F7/00

摘要： The present invention provides an electrolytic processing apparatus and an electrolytic processing method which can effectively prevent the formation of pits that would impair the quality of the processed product. The electrolytic processing apparatus including: a processing electrode (210) for processing a workpiece; a feeding electrode (212) for feeding electricity to the workpiece; a power source (232) for applying a voltage between the processing electrode (210) and the feeding electrode (212); a pressure tight container (200) housing the processing electrode (210) and the feeding electrode (212) therein; and a high-pressure liquid supply system (204) for supplying a high-pressure liquid into the pressure tight container (210).

摘要翻译： 本发明提供一种电解处理装置和电解处理方法，其可以有效地防止会影响加工产品质量的凹坑的形成。 电解处理装置包括：处理工件的处理电极; 用于向工件供电的供电电极（212）; 用于在处理电极（210）和馈电电极（212）之间施加电压的电源（232）; 容纳所述处理电极（210）和所述馈电电极（212）的压力容器（200）; 以及用于将高压液体供应到耐压容器（210）中的高压液体供给系统（204）。

公开(公告)号：US20050035001A1

公开(公告)日：2005-02-17

申请号：US10914190

申请日：2004-08-10

申请人： Hozumi Yasuda ,  Ikutaro Noji ,  Kazuto Hirokawa ,  Takeshi Iizumi ,  Itsuki Kobata

发明人： Hozumi Yasuda ,  Ikutaro Noji ,  Kazuto Hirokawa ,  Takeshi Iizumi ,  Itsuki Kobata

IPC分类号： B23H3/00 ,  C25D5/02 ,  C25F7/02

CPC分类号： C25F7/02

摘要： There are provided an electrolytic processing apparatus and an electrolytic processing method which can regenerate an ion exchanger with an enhanced regeneration rate of ion-exchange capacity without adversely affecting the throughput of the apparatus. The electrolytic processing apparatus includes: a holder for holding a workpiece; an electrode section including an electrode, a contact member, and a discharge portion for discharging metal ions which have been taken from the workpiece into the contact member during processing, said electrode section coming close to or into contact with the workpiece held by the holder to effect processing of the workpiece in the presence of a liquid; and a regeneration dummy electrode which can come close to or into contact with the contact member.

摘要翻译： 提供一种电解处理装置和电解处理方法，其可以以提高的离子交换容量的再生速率再生离子交换器，而不会不利地影响装置的生产量。 电解处理装置包括：用于保持工件的保持器; 电极部分，包括电极，接触部件和用于在处理期间从工件中取出的金属离子放电到接触部件中的放电部分，所述电极部分靠近或与保持件保持的工件接触或接触 在液体存在下对工件进行加工; 以及能够靠近或与接触构件接触的再生虚拟电极。

公开(公告)号：US20070095659A1

公开(公告)日：2007-05-03

申请号：US10559724

申请日：2004-07-28

申请人： Hozumi Yasuda ,  Ikutaro Noji ,  Kazuto Hirokawa ,  Takeshi Iizumi ,  Itsuki Kobata

发明人： Hozumi Yasuda ,  Ikutaro Noji ,  Kazuto Hirokawa ,  Takeshi Iizumi ,  Itsuki Kobata

IPC分类号： C25D17/00

CPC分类号： C25F7/00 ,  H01L21/32115

摘要： The present invention provides an electrolytic processing apparatus and an electrolytic processing method which can perform processing of a substrate without destroying devices formed in the substrate even when a fragile material is employed in the substrate and which can reduce non-uniformity in the contact pressure of an electrode member on a substrate during processing, thereby equalizing the processing amount in the entire processing surface of the substrate and the surface roughness after processing. The electrolytic processing apparatus includes: a substrate holder for holding a substrate; an electrode base provided with an electrode member for contact with the substrate, held by the substrate holder, in the presence of a liquid to effect processing of the substrate; and a support base for floatingly supporting the electrode base by a floating mechanism.

摘要翻译： 本发明提供一种电解处理装置和电解处理方法，其即使在基板中使用易碎材料，也可以在不破坏形成在基板中的装置的情况下进行基板的处理，并且可以降低基板的接触压力的不均匀性 电极部件在处理时在基板上，从而使基板的整个加工面的加工量与加工后的表面粗糙度相等。 电解处理装置包括：用于保持基板的基板保持件; 电极基体，设置有用于与所述基板接触的电极部件，所述电极部件由所述基板保持件保持在所述液体的存在下，以进行所述基板的加工; 以及用于通过浮动机构浮动地支撑电极基座的支撑基座。

公开(公告)号：US07578920B2

公开(公告)日：2009-08-25

申请号：US10948320

申请日：2004-09-24

申请人： Ikutaro Noji ,  Hozumi Yasuda ,  Takeshi Iizumi ,  Kazuto Hirokawa ,  Itsuki Kobata

发明人： Ikutaro Noji ,  Hozumi Yasuda ,  Takeshi Iizumi ,  Kazuto Hirokawa ,  Itsuki Kobata

IPC分类号： C25D21/12 ,  C25F3/02

CPC分类号： C25F7/00

摘要： An electrolytic processing apparatus can detect the end point of electrolytic processing stably with high precision and with a relatively simple construction. The electrolytic processing apparatus includes: a processing electrode which can come close to or into contact with a processing object; a feeding electrode for feeding electricity to the processing object; a fluid supply section for supplying fluid between the processing object and at least one of the processing electrode and the feeding electrode; a processing power source for applying a voltage between the processing electrode and the feeding electrode; a drive section for causing relative movement between the processing object and at least one of the processing electrode and the feeding electrode; and an eddy current sensor for detecting the thickness of the processing object from a change in eddy current loss. The sensor is disposed not in contact with (or separately) by an insulator from the processing electrode and/or the feeding electrode.

摘要翻译： 电解处理装置可以以高精度和相对简单的结构稳定地检测电解处理的终点。 电解处理装置包括：处理电极，其能够接近或与处理对象接触; 用于向处理对象供电的馈电电极; 流体供应部分，用于在处理对象与处理电极和馈送电极中的至少一个之间提供流体; 用于在处理电极和馈电电极之间施加电压的处理电源; 驱动部，其用于使处理对象与所述处理电极和所述馈送电极中的至少一个相对移动; 以及用于从涡流损耗的变化中检测加工对象的厚度的涡流传感器。 传感器设置成不与来自处理电极和/或馈电电极的绝缘体接触（或单独地）接触。

公开(公告)号：US07476303B2

公开(公告)日：2009-01-13

申请号：US10914190

申请日：2004-08-10

申请人： Hozumi Yasuda ,  Ikutaro Noji ,  Kazuto Hirokawa ,  Takeshi Iizumi ,  Itsuki Kobata

发明人： Hozumi Yasuda ,  Ikutaro Noji ,  Kazuto Hirokawa ,  Takeshi Iizumi ,  Itsuki Kobata

IPC分类号： C25F3/16 ,  B23H5/06 ,  B23H5/10 ,  B23H5/14

CPC分类号： C25F7/02

摘要： There are provided an electrolytic processing apparatus and an electrolytic processing method which can regenerate an ion exchanger with an enhanced regeneration rate of ion-exchange capacity without adversely affecting the throughput of the apparatus. The electrolytic processing apparatus includes: a holder for holding a workpiece; an electrode section including an electrode, a contact member, and a discharge portion for discharging metal ions which have been taken from the workpiece into the contact member during processing, said electrode section coming close to or into contact with the workpiece held by the holder to effect processing of the workpiece in the presence of a liquid; and a regeneration dummy electrode which can come close to or into contact with the contact member.

摘要翻译： 提供一种电解处理装置和电解处理方法，其可以以提高的离子交换容量的再生速率再生离子交换器，而不会不利地影响装置的生产量。 电解处理装置包括：用于保持工件的保持器; 电极部分，包括电极，接触部件和用于在处理期间从工件中取出的金属离子放电到接触部件中的放电部分，所述电极部分靠近或与保持件保持的工件接触或接触 在液体存在下对工件进行加工; 以及能够靠近或与接触构件接触的再生虚拟电极。

公开(公告)号：US20050067289A1

公开(公告)日：2005-03-31

申请号：US10948320

申请日：2004-09-24

申请人： Ikutaro Noji ,  Hozumi Yasuda ,  Takeshi Iizumi ,  Kazuto Hirokawa ,  Itsuki Kobata

发明人： Ikutaro Noji ,  Hozumi Yasuda ,  Takeshi Iizumi ,  Kazuto Hirokawa ,  Itsuki Kobata

IPC分类号： C25C7/06 ,  C25F7/00

CPC分类号： C25F7/00

摘要： An electrolytic processing apparatus can detect the endpoint of electrolytic processing stably with high precision and with a relatively simple construction. The electrolytic processing apparatus including: a processing electrode which can come close to or into contact with a processing object; a feeding electrode for feeding electricity to the processing object; a fluid supply section for supplying fluid between the processing object and at least one of the processing electrode and the feeding electrode; a processing power source for applying a voltage between the processing electrode and the feeding electrode; a drive section for causing relative movement between the processing object and at least one of the processing electrode and the feeding electrode; and an eddy current sensor for detecting the thickness of the processing object from a change in eddy current loss, said sensor being disposed not in contact with or separately by an insulator from the processing electrode and/or the feeding electrode.

摘要翻译： 电解处理装置能够以高精度和相对简单的结构稳定地检测电解加工的终点。 该电解处理装置包括：处理电极，其能够接近或与处理对象接触; 用于向处理对象供电的馈电电极; 流体供应部分，用于在处理对象与处理电极和馈送电极中的至少一个之间提供流体; 用于在处理电极和馈电电极之间施加电压的处理电源; 驱动部，其用于使处理对象与所述处理电极和所述馈送电极中的至少一个相对移动; 以及涡流传感器，用于根据涡流损耗的变化来检测加工对象的厚度，所述传感器被设置成不与处理电极和/或馈电电极接触或分离。

公开(公告)号：US07569135B2

公开(公告)日：2009-08-04

申请号：US11723934

申请日：2007-03-22

申请人： Mitsuhiko Shirakashi ,  Masayuki Kumekawa ,  Hozumi Yasuda ,  Itsuki Kobata ,  Ikutaro Noji ,  Kaori Yoshida

发明人： Mitsuhiko Shirakashi ,  Masayuki Kumekawa ,  Hozumi Yasuda ,  Itsuki Kobata ,  Ikutaro Noji ,  Kaori Yoshida

IPC分类号： C25F3/16 ,  B23H5/06

CPC分类号： C25F7/00 ,  B23H3/00 ,  B23H3/04 ,  B23H3/08 ,  B23H5/08 ,  B24B37/04 ,  C25F3/00 ,  C25F5/00 ,  H01L21/32115 ,  H01L21/3212

摘要： The present invention replaces all or a portion of substrate processing by chemical-mechanical polishing with electrolytic processing using deionized water, ultrapure water or the like. An electrolytic processing apparatus comprises: a chemical-mechanical polishing section for chemically-mechanically polishing a surface of a substrate; an electrolytic processing section having a processing electrode and a feeding electrode, and also having an ion exchanger provided at least either between the substrate and the processing electrode or between the substrate and the feeding electrode, for electrolytically processing a surface of a workpiece under existence of a solution by applying a voltage between the processing electrode and the feeding electrode; and a top ring capable of freely moving between the chemical-mechanical polishing section and the processing electrode section.

摘要翻译： 本发明通过使用去离子水，超纯水等的电解处理通过化学机械抛光来代替基板处理的全部或一部分。 电解处理设备包括：化学机械抛光部分，用于对基材的表面进行化学机械抛光; 具有处理电极和供电电极的电解处理部分，并且还具有设置在基板和处理电极之间或者基板和供电电极之间的至少一个的离子交换器，用于在存在的工件的表面进行电解处理 通过在处理电极和馈电电极之间施加电压的解决方案; 以及能够在所述化学机械抛光部和所述处理电极部之间自由移动的顶环。

公开(公告)号：US20070181432A1

公开(公告)日：2007-08-09

申请号：US11723934

申请日：2007-03-22

申请人： Mitsuhiko Shirakashi ,  Masayuki Kumekawa ,  Hozumi Yasuda ,  Itsuki Kobata ,  Ikutaro Noji ,  Kaori Yoshida

发明人： Mitsuhiko Shirakashi ,  Masayuki Kumekawa ,  Hozumi Yasuda ,  Itsuki Kobata ,  Ikutaro Noji ,  Kaori Yoshida

IPC分类号： C25D5/10

CPC分类号： C25F7/00 ,  B23H3/00 ,  B23H3/04 ,  B23H3/08 ,  B23H5/08 ,  B24B37/04 ,  C25F3/00 ,  C25F5/00 ,  H01L21/32115 ,  H01L21/3212

摘要： The present invention replaces all or a portion of substrate processing by chemical-mechanical polishing with electrolytic processing using deionized water, ultrapure water or the like. An electrolytic processing apparatus comprises: a chemical-mechanical polishing section for chemically-mechanically polishing a surface of a substrate; an electrolytic processing section having a processing electrode and a feeding electrode, and also having an ion exchanger provided at least either between the substrate and the processing electrode or between the substrate and the feeding electrode, for electrolytically processing a surface of a workpiece under existence of a solution by applying a voltage between the processing electrode and the feeding electrode; and a top ring capable of freely moving between the chemical-mechanical polishing section and the processing electrode section.

摘要翻译： 本发明通过使用去离子水，超纯水等的电解处理通过化学机械抛光来代替基板处理的全部或一部分。 电解处理设备包括：化学机械抛光部分，用于对基材的表面进行化学机械抛光; 具有处理电极和供电电极的电解处理部分，并且还具有设置在基板和处理电极之间或基板与供电电极之间的至少一个的离子交换器，用于在存在的工件的表面上电解处理 通过在处理电极和馈电电极之间施加电压的解决方案; 以及能够在所述化学机械抛光部和所述处理电极部之间自由移动的顶环。

公开(公告)号：US20080314763A1

公开(公告)日：2008-12-25

申请号：US12222733

申请日：2008-08-14

申请人： Takayuki Saito ,  Tsukuru Suzuki ,  Yuji Makita ,  Kaoru Yamada ,  Masayuki Kumekawa ,  Hozumi Yasuda ,  Osamu Nabeya ,  Kazuto Hirokawa ,  Mitsuhiro Shirakashi ,  Yasushi Toma ,  Itsuki Kobata

发明人： Takayuki Saito ,  Tsukuru Suzuki ,  Yuji Makita ,  Kaoru Yamada ,  Masayuki Kumekawa ,  Hozumi Yasuda ,  Osamu Nabeya ,  Kazuto Hirokawa ,  Mitsuhiro Shirakashi ,  Yasushi Toma ,  Itsuki Kobata

IPC分类号： C25F1/00 ,  C25F7/00

CPC分类号： C25F3/00 ,  B01J49/30 ,  C25F7/00

摘要： A method and device for regenerating an ion exchanger can regenerate an ion exchanger easily and quickly, and can minimize a load upon cleaning of the regenerated ion exchanger and disposal of waste liquid. A method for regenerating a contaminated ion exchanger includes: providing a pair of a regeneration electrode and a counter electrode, a partition disposed between the electrodes, and an ion exchanger to be regenerated disposed between the counter electrode and the partition; and applying a voltage between the regeneration electrode and the counter electrode while supplying a liquid between the partition and the regeneration electrode and also supplying a liquid between the partition and the counter electrode.

摘要翻译： 用于再生离子交换剂的方法和装置可以容易且快速地再生离子交换器，并且可以在再生离子交换器的清洁和废液的处理时最小化负载。 再生污染离子交换器的方法包括：提供一对再生电极和对置电极，设置在电极之间的隔板和设置在对电极与隔板之间的再生用离子交换器; 并在再生电极和对电极之间施加电压，同时在隔板和再生电极之间提供液体，并且还在分隔件和对电极之间供应液体。