Invention Grant
US07579679B2 Chipcard with contact areas and method for producing contact areas
有权
具有接触区域的芯片卡和用于产生接触区域的方法
- Patent Title: Chipcard with contact areas and method for producing contact areas
- Patent Title (中): 具有接触区域的芯片卡和用于产生接触区域的方法
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Application No.: US11392451Application Date: 2006-03-29
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Publication No.: US07579679B2Publication Date: 2009-08-25
- Inventor: Frank Püschner , Wolfgang Schindler , Ewald Simmerlein-Erlbacher , Peter Stampka
- Applicant: Frank Püschner , Wolfgang Schindler , Ewald Simmerlein-Erlbacher , Peter Stampka
- Applicant Address: DE
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE
- Agency: Dickstein, Shapiro, LLP.
- Priority: DE10345257 20030929
- Main IPC: H01L23/02
- IPC: H01L23/02
Abstract:
A chip card with a chip module having an integrated circuit and, for external contacting, has on a main face a contact zone with a number of contact areas which are spaced apart from one another and are electrically connected to the integrated circuit. At least one contact area is made up of first functional regions with first surfaces and of second functional regions with second surfaces, and the first surfaces of the first functional regions lie higher with respect to the main face than the second surfaces of the second functional regions.
Public/Granted literature
- US20060246628A1 Chipcard with contact areas and method for producing contact areas Public/Granted day:2006-11-02
Information query
IPC分类:
