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1.发明授权公开(公告)号：US07579679B2
公开(公告)日：2009-08-25
申请号：US11392451
申请日：2006-03-29
IPC分类号： H01L23/02
CPC分类号： G06K19/07747 , G06K19/07743 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48465 , H01L2224/73265 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/00014 , H01L2924/00
摘要： A chip card with a chip module having an integrated circuit and, for external contacting, has on a main face a contact zone with a number of contact areas which are spaced apart from one another and are electrically connected to the integrated circuit. At least one contact area is made up of first functional regions with first surfaces and of second functional regions with second surfaces, and the first surfaces of the first functional regions lie higher with respect to the main face than the second surfaces of the second functional regions.
摘要翻译： 具有集成电路并且用于外部接触的芯片模块的芯片卡在主表面上具有彼此间隔开并且与集成电路电连接的多个接触区域的接触区域。 至少一个接触区域由具有第一表面的第一功能区域和具有第二表面的第二功能区域构成，并且第一功能区域的第一表面相对于主面高于第二功能区域的第二表面 。
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公开(公告)号：US20060246628A1
公开(公告)日：2006-11-02
申请号：US11392451
申请日：2006-03-29
IPC分类号： H01L21/00 , H01L23/10 , H01L23/043
CPC分类号： G06K19/07747 , G06K19/07743 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48465 , H01L2224/73265 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/00014 , H01L2924/00
摘要： A chip card with a chip module having an integrated circuit and, for external contacting, has on a main face a contact zone with a number of contact areas which are spaced apart from one another and are electrically connected to the integrated circuit. At least one contact area is made up of first functional regions with first surfaces and of second functional regions with second surfaces, and the first surfaces of the first functional regions lie higher with respect to the main face than the second surfaces of the second functional regions.
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公开(公告)号：US07240847B2
公开(公告)日：2007-07-10
申请号：US11078202
申请日：2005-03-10
IPC分类号： G06K19/06
CPC分类号： G06K19/07724 , B29C45/14647 , B29C45/14836 , B29C2045/14844 , B29L2031/3456 , G06K19/0773 , G06K19/07749
摘要： A contactless chip card and a method for producing a contactless chip card in which a plastic carrier having clearances is provided, on which an antenna coil is arranged on an upper side of the plastic carrier and a device having an integrated circuit is arranged on a rear side of the plastic carrier that is opposite from the upper side, an electrical connection is produced between the coil and the device, the plastic carrier is introduced into an injection mold and a card body is molded onto the rear side of the plastic carrier by the injection-molding process.
摘要翻译： 一种非接触式芯片卡和一种制造非接触式芯片卡的方法，其中提供了具有间隙的塑料载体，天线线圈布置在塑料载体的上侧，具有集成电路的装置设置在后部 与上侧相反的塑料载体的侧面，在线圈和装置之间产生电连接，塑料载体被引入注射模具中，并且卡体通过塑料载体的后侧模制 注塑工艺。
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公开(公告)号：US07694888B2
公开(公告)日：2010-04-13
申请号：US11560058
申请日：2006-11-15
IPC分类号： G06K19/06
CPC分类号： G06K19/077
摘要： A method for producing a contact zone for a chip card has the following steps. A sheet having a first surface and a second surface opposite the first surface. Forming at least one insulating trench, which extends from the first surface to the second surface. A cluster layer is applied to the first surface. The second surface is connected to a carrier element after the cluster layer has been applied to the first surface.
摘要翻译： 用于制造芯片卡的接触区域的方法具有以下步骤。 一种具有与第一表面相对的第一表面和第二表面的片材。 形成从第一表面延伸到第二表面的至少一个绝缘沟槽。 将簇层应用于第一表面。 在将簇层施加到第一表面之后，第二表面连接到载体元件。
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公开(公告)号：US20070148859A1
公开(公告)日：2007-06-28
申请号：US11560058
申请日：2006-11-15
IPC分类号： H01L21/8242
CPC分类号： G06K19/077
摘要： A method for producing a contact zone for a chip card has the following steps. A sheet having a first surface and a second surface opposite the first surface. Forming at least one insulating trench, which extends from the first surface to the second surface. A cluster layer is applied to the first surface. The second surface is connected to a carrier element after the cluster layer has been applied to the first surface.
摘要翻译： 用于制造芯片卡的接触区域的方法具有以下步骤。 一种具有与第一表面相对的第一表面和第二表面的片材。 形成从第一表面延伸到第二表面的至少一个绝缘沟槽。 将簇层应用于第一表面。 在将簇层施加到第一表面之后，第二表面连接到载体元件。
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公开(公告)号：US07337967B2
公开(公告)日：2008-03-04
申请号：US11288990
申请日：2005-11-28
IPC分类号： G06K7/10
CPC分类号： G06K19/06046 , G06K19/14
摘要： A chip card module having a carrier with contact areas. Arranged on the carrier lying opposite the contact areas is a semiconductor chip, which has an integrated circuit which has on a surface of the chip terminal contacts which are connected in an electrically conducting manner to assigned contact areas. The contact areas have a first conducting layer and a second conducting layer, with cluster elements embedded in the second conducting layer.
摘要翻译： 一种具有接触区域的载体的芯片卡模块。 布置在与接触区域相对的载体上的是具有集成电路的半导体芯片，该集成电路在芯片端子触点的表面上以导电的方式连接到分配的接触区域。 接触区域具有第一导电层和第二导电层，其中簇元件嵌入第二导电层中。
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公开(公告)号：US20060118642A1
公开(公告)日：2006-06-08
申请号：US11288990
申请日：2005-11-28
IPC分类号： G06K19/06
CPC分类号： G06K19/06046 , G06K19/14
摘要： A chip card module having a carrier with contact areas. Arranged on the carrier lying opposite the contact areas is a semiconductor chip, which has an integrated circuit which has on a surface of the chip terminal contacts which are connected in an electrically conducting manner to assigned contact areas. The contact areas have a first conducting layer and a second conducting layer, with cluster elements embedded in the second conducting layer.
摘要翻译： 一种具有接触区域的载体的芯片卡模块。 布置在与接触区域相对的载体上的是具有集成电路的半导体芯片，该集成电路在芯片端子触点的表面上以导电的方式连接到分配的接触区域。 接触区域具有第一导电层和第二导电层，其中簇元件嵌入第二导电层中。
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公开(公告)号：US20060043200A1
公开(公告)日：2006-03-02
申请号：US11211167
申请日：2005-08-23
IPC分类号： G06K19/06
CPC分类号： G06K19/07747 , G06K19/07745 , H01L2224/16 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/01079 , H01L2224/0401
摘要： A chip card module for a contactless chip card having a chip containing an integrated circuit, and having a coupling element, electrically connected to the chip to permit contactless communication. The chip card module has a layer sequence formed on a surface side of the chip card module, with a first layer reflecting electromagnetic waves, a second layer arranged on this first layer, and a third layer, in which a metallic cluster is embedded, arranged on the second layer.
摘要翻译： 一种用于非接触芯片卡的芯片卡模块，其具有包含集成电路的芯片，并且具有电连接到所述芯片以允许非接触式通信的耦合元件。 芯片卡模块具有形成在芯片卡模块的表面侧的层序列，具有反射电磁波的第一层，布置在该第一层上的第二层和布置有金属簇的第三层 在第二层。
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9.发明授权Microprocessor, in particular for use in a chip card, with a control unit and with a housing surrounding the control unit 有权微处理器，特别是用于芯片卡，具有控制单元和围绕控制单元的壳体公开(公告)号：US06185507B2
公开(公告)日：2001-02-06
申请号：US09255991
申请日：1999-02-23
申请人： Michael Huber , Peter Stampka , Josef Heitzer
发明人： Michael Huber , Peter Stampka , Josef Heitzer
IPC分类号： G01N2710
CPC分类号： G07F7/1008 , G06F21/86 , G06F21/87 , G06K19/07 , G06K19/0716 , G06K19/073 , G06K19/07372 , G06Q20/341 , G07F7/082
摘要： A microprocessor has a control unit with a housing surrounding the control unit. The invention also relates to a chip card having such a microprocessor that is protected against manipulations. At least one sensor indicates ambient states and is connected to the control unit and is provided in a region of the housing of the microprocessor. The control unit is configured in such a way that it can be placed in an inactive state if a measurement signal that indicates a predetermined ambient state is and/or is not fed to the control unit from the sensor.
摘要翻译： 微处理器具有控制单元，其具有围绕控制单元的壳体。 本发明还涉及具有这种微处理器的芯片卡，该微处理器被保护以防止操作。 至少一个传感器指示环境状态并且连接到控制单元并且设置在微处理器的壳体的区域中。 如果指示预定环境状态的测量信号和/或没有从传感器馈送到控制单元，则控制单元被配置为使其能够处于非活动状态。
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公开(公告)号：USD405779S
公开(公告)日：1999-02-16
申请号：US70054
申请日：1997-04-25
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