公开(公告)号：US06719205B1

公开(公告)日：2004-04-13

申请号：US09333322

申请日：1999-06-15

申请人： Frank Püschner ,  Jürgen Fischer ,  Josef Heitzer

发明人： Frank Püschner ,  Jürgen Fischer ,  Josef Heitzer

IPC分类号： G06K1906

CPC分类号： G06K19/0775 ,  G06K19/07749 ,  H01L23/49855 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/45099 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48471 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/3025 ,  Y10T29/49146 ,  H01L2924/00 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05599 ,  H01L2224/85399

摘要： A carrier element for a semiconductor chip and in particular for incorporation into smart cards. The carrier element has an encapsulation composition protecting the semiconductor chip. The carrier element connections are disposed on one of the main surfaces of the encapsulation composition along only two opposite edges. They are made of a conductive material and have a reduced thickness at the ends facing one another, the cross section having a step only on one side. The semiconductor chip is disposed on the connections in a region of the section of reduced thickness and is mechanically connected to the connections.

摘要翻译： 用于半导体芯片的载体元件，特别是用于并入智能卡。 载体元件具有保护半导体芯片的封装组合物。 载体元件连接仅沿两个相对的边缘设置在封装组合物的一个主表面上。 它们由导电材料制成，并且在彼此面对的端部处具有减小的厚度，该截面仅在一侧具有台阶。 半导体芯片设置在厚度较小部分的区域中的连接处并机械连接到连接。

公开(公告)号：US06992898B2

公开(公告)日：2006-01-31

申请号：US10160629

申请日：2002-06-03

申请人： Erik Heinemann ,  Frank Püschner ,  Detlef Houdeau

发明人： Erik Heinemann ,  Frank Püschner ,  Detlef Houdeau

IPC分类号： H05K7/02 ,  H05K3/30 ,  H05K1/02

CPC分类号： G06K19/07743

摘要： A smart-card module is described which has a substrate film of an anisotropically conductive material and at least one semiconductor chip. The semiconductor chip has connection points. On one surface of the semiconductor film, contact areas are applied directly. The substrate film is disposed between the semiconductor chip and the contact areas in such a way that it connects the connection points of the semiconductor chip to the contact areas in a manner of a direct contact.

公开(公告)号：US06469902B1

公开(公告)日：2002-10-22

申请号：US09440409

申请日：1999-11-15

申请人： Frank Püschner ,  Erik Heinemann ,  Ralf Henn

发明人： Frank Püschner ,  Erik Heinemann ,  Ralf Henn

IPC分类号： H05K114

CPC分类号： B32B27/08 ,  B32B7/12 ,  B32B27/308 ,  B32B27/36 ,  B32B27/365 ,  B32B27/38 ,  B32B2262/101 ,  B32B2307/202 ,  B32B2405/00 ,  B32B2425/00 ,  G06K19/041 ,  G06K19/07722 ,  G06K19/07745 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2924/00014 ,  H01L2924/00

摘要： The invention relates to an adhesive joint which connects a body made of a first material to a plastic body. The adhesive joint is formed by an adhesive laminate which includes a flexible core layer made of acrylate and outer layers made of hot-melt adhesive which respectively adjoin the first body and the plastic body, and a transition layer is respectively arranged between the outer layers and the core layer.

摘要翻译： 本发明涉及将由第一材料制成的本体连接到塑料体上的粘接接头。 粘合剂接合体由粘合剂层压体形成，该粘合剂层压体包括由丙烯酸酯制成的柔性芯层和由热熔粘合剂制成的外层，其分别邻接第一主体和塑料体，并且过渡层分别设置在外层和 核心层。

公开(公告)号：US07579679B2

公开(公告)日：2009-08-25

申请号：US11392451

申请日：2006-03-29

申请人： Frank Püschner ,  Wolfgang Schindler ,  Ewald Simmerlein-Erlbacher ,  Peter Stampka

发明人： Frank Püschner ,  Wolfgang Schindler ,  Ewald Simmerlein-Erlbacher ,  Peter Stampka

IPC分类号： H01L23/02

CPC分类号： G06K19/07747 ,  G06K19/07743 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/00014 ,  H01L2924/00

摘要： A chip card with a chip module having an integrated circuit and, for external contacting, has on a main face a contact zone with a number of contact areas which are spaced apart from one another and are electrically connected to the integrated circuit. At least one contact area is made up of first functional regions with first surfaces and of second functional regions with second surfaces, and the first surfaces of the first functional regions lie higher with respect to the main face than the second surfaces of the second functional regions.

摘要翻译： 具有集成电路并且用于外部接触的芯片模块的芯片卡在主表面上具有彼此间隔开并且与集成电路电连接的多个接触区域的接触区域。 至少一个接触区域由具有第一表面的第一功能区域和具有第二表面的第二功能区域构成，并且第一功能区域的第一表面相对于主面高于第二功能区域的第二表面 。

公开(公告)号：US07069652B2

公开(公告)日：2006-07-04

申请号：US10264873

申请日：2002-10-04

申请人： Erik Heinemann ,  Frank Püschner

发明人： Erik Heinemann ,  Frank Püschner

IPC分类号： H01K3/10

CPC分类号： G06K19/07718 ,  G06K19/077 ,  G06K19/0775 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/01004 ,  Y10S174/34 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A smart card is laminated from at least two layers of paper or film as a mounting material. A first of the layers is fitted with a semiconductor chip and a second layer has connecting contacts as well as conductor tracks or external connecting surfaces. The contacts of the semiconductor chips are electrically conductively connected to the connecting contacts on the second layer. No chip modules are required to produce the smart cards. The mounting materials provided with ICs and contacts can be laminated in an endless roll format, in the same way as for paper production.

公开(公告)号：US06472250B1

公开(公告)日：2002-10-29

申请号：US09494776

申请日：2000-01-31

申请人： Frank Püschner ,  Jürgen Fischer ,  Erik Heinemann

发明人： Frank Püschner ,  Jürgen Fischer ,  Erik Heinemann

IPC分类号： H01L2144

CPC分类号： G06K19/07747 ,  G06K19/07745 ,  H01L2224/48091 ,  H01L2924/18301 ,  H01L2924/00014

摘要： A method for producing a chip module includes punching a chip carrier to form a chip carrier fixing section and chip carrier contact sections spaced apart from the chip carrier fixing section by slots defining a given distance. The given distance is subsequently reduced to a dimension preventing a flow through of a sealing mass by a swaging operation carried out at least in a region close to the slots.

摘要翻译： 一种芯片模块的制造方法包括冲压芯片载体以形成芯片载体固定部分和芯片载体接触部分，该芯片载体接触部分通过限定给定距离的狭缝与芯片载体固定部分间隔开。 给定距离随后被减小到通过至少在靠近槽的区域中进行的模锻操作来防止密封块流过的尺寸。

公开(公告)号：US07240847B2

公开(公告)日：2007-07-10

申请号：US11078202

申请日：2005-03-10

申请人： Frank Püschner ,  Reinhard Proske ,  Peter Stampka ,  Andreas Müller-Hipper

发明人： Frank Püschner ,  Reinhard Proske ,  Peter Stampka ,  Andreas Müller-Hipper

IPC分类号： G06K19/06

CPC分类号： G06K19/07724 ,  B29C45/14647 ,  B29C45/14836 ,  B29C2045/14844 ,  B29L2031/3456 ,  G06K19/0773 ,  G06K19/07749

摘要： A contactless chip card and a method for producing a contactless chip card in which a plastic carrier having clearances is provided, on which an antenna coil is arranged on an upper side of the plastic carrier and a device having an integrated circuit is arranged on a rear side of the plastic carrier that is opposite from the upper side, an electrical connection is produced between the coil and the device, the plastic carrier is introduced into an injection mold and a card body is molded onto the rear side of the plastic carrier by the injection-molding process.

摘要翻译： 一种非接触式芯片卡和一种制造非接触式芯片卡的方法，其中提供了具有间隙的塑料载体，天线线圈布置在塑料载体的上侧，具有集成电路的装置设置在后部 与上侧相反的塑料载体的侧面，在线圈和装置之间产生电连接，塑料载体被引入注射模具中，并且卡体通过塑料载体的后侧模制 注塑工艺。

公开(公告)号：US06778407B2

公开(公告)日：2004-08-17

申请号：US10211077

申请日：2002-08-02

申请人： Jürgen Fischer ,  Manfred Fries ,  Frank Püschner ,  Annemarie Seidl

发明人： Jürgen Fischer ,  Manfred Fries ,  Frank Püschner ,  Annemarie Seidl

IPC分类号： H05K710

CPC分类号： G06K19/07728 ,  G06K19/07743 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48228 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

摘要： A portable data carrier includes a card-shaped body having a recess for receiving a chip module. The chip module includes at least one semiconductor chip on a first main side of a chip carrier connected to the card-shaped body, and a metallization layer disposed on a second main side of the chip carrier and having contact lugs. The chip carrier has desired bending points which, upon the occurrence of bending stresses, reduce forces on the semiconductor chip and wire connections.

摘要翻译： 便携式数据载体包括具有用于接收芯片模块的凹部的卡形体。 芯片模块包括在与卡形体连接的芯片载体的第一主侧上的至少一个半导体芯片，以及设置在芯片载体的第二主侧上并具有接触凸耳的金属化层。 芯片载体具有所需的弯曲点，其在发生弯曲应力时减小半导体芯片和电线连接上的力。

公开(公告)号：US06375083B2

公开(公告)日：2002-04-23

申请号：US09354131

申请日：1999-07-15

申请人： Manfred Fries ,  Frank Püschner ,  Josef Mundigl ,  Jürgen Fischer ,  Detlef Houdeau

发明人： Manfred Fries ,  Frank Püschner ,  Josef Mundigl ,  Jürgen Fischer ,  Detlef Houdeau

IPC分类号： G06K1906

CPC分类号： G06K19/07747 ,  G06K19/07749 ,  G06K19/07779 ,  G06K19/07783 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01078 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2924/00

摘要： A smart card with a card carrier on which a data processing circuit and also a connection assembly for the contactless communication of data between the data processing circuit and an external data processing station are provided. In the course of producing a prior art smart card, an integrated circuit is applied to a card carrier made of plastic. Afterwards, a transmitting/receiving coil connected to corresponding terminals of the integrated circuit is applied along the outer edges of the prior art smart card. In the case of the prior art smart card, the fact that defective prior art smart cards have to be destroyed is disadvantageous. According to the invention, the data processing circuit and the connection assembly are provided in a region of at least one module carrier and the card carrier has a region for accommodating the module carrier. This makes it possible firstly to test the completed module carrier in respect of its proper functioning before it is incorporated into a card carrier.

摘要翻译： 一种具有卡载体的智能卡，其上提供有数据处理电路和数据处理电路与外部数据处理站之间的数据无接触通信的连接组件。 在生产现有技术的智能卡的过程中，将集成电路应用于由塑料制成的卡片载体。 之后，沿着现有技术的智能卡的外边缘施加连接到集成电路的相应端子的发送/接收线圈。 在现有技术的智能卡的情况下，缺陷的现有技术的智能卡必须被销毁的事实是不利的。 根据本发明，数据处理电路和连接组件设置在至少一个模块载体的区域中，并且卡载体具有用于容纳模块载体的区域。 这使得首先可以在完成的模块载体合并到卡载体之前对其正常工作进行测试。

公开(公告)号：US06557769B2

公开(公告)日：2003-05-06

申请号：US10083039

申请日：2002-02-26

申请人： Frank Püschner ,  Erik Heinemann ,  Jürgen Fischer

发明人： Frank Püschner ,  Erik Heinemann ,  Jürgen Fischer

IPC分类号： G06K1906

CPC分类号： G06K19/07747 ,  G06K19/07743 ,  G06K19/07745 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2924/00014 ,  H01L2924/0102 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/00 ,  H01L2224/05599

摘要： Flip-chip bumps (solder bumps) are applied on the contact-connection points of a semiconductor chip. These bumps extend from there through a covering compound (mold) that is applied as a protective layer. The end of each one of the bumps that is remote from the semiconductor chip forms a pad. This pad lies approximately plane-parallel in the surface of the covering compound that is remote from the semiconductor chip. At least during the encapsulation process, the chips are preferably arranged on a carrier element, in particular a carrier strip.