Invention Grant
US07582186B2 Method and apparatus for an improved focus ring in a plasma processing system
失效
用于等离子体处理系统中改进的聚焦环的方法和装置
- Patent Title: Method and apparatus for an improved focus ring in a plasma processing system
- Patent Title (中): 用于等离子体处理系统中改进的聚焦环的方法和装置
-
Application No.: US10739127Application Date: 2003-12-19
-
Publication No.: US07582186B2Publication Date: 2009-09-01
- Inventor: Eric J. Strang , Steven T. Fink
- Applicant: Eric J. Strang , Steven T. Fink
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
- Main IPC: C23C16/00
- IPC: C23C16/00 ; C23F1/00 ; H01L21/306

Abstract:
A focus ring configured to be coupled to a substrate holder comprises a first surface exposed to a process; a second surface, opposite the first surface, for coupling to an upper surface of the substrate holder; an inner radial edge for facing a periphery of a substrate; and an outer radial edge. The second surface further comprises one or more contact features, each of which is configured to mate with one or more receiving features formed within the upper surface of the substrate holder. The focus ring can further comprise a clamping feature for mechanically clamping the focus ring to the substrate holder. Furthermore, a gas can be supplied to the contact space residing between the one or more contact features on the focus ring and the one or more receiving features on the substrate holder.
Public/Granted literature
- US20040129226A1 Method and apparatus for an improved focus ring in a plasma processing system Public/Granted day:2004-07-08
Information query
IPC分类: