发明授权
- 专利标题: Substrate susceptors for receiving semiconductor substrates to be deposited upon
- 专利标题(中): 用于接收要沉积的半导体衬底的衬底感受体
-
申请号: US10822093申请日: 2004-04-08
-
公开(公告)号: US07585371B2公开(公告)日: 2009-09-08
- 发明人: Eric R. Blomiley , Nirmal Ramaswamy , Ross S. Dando , Joel A. Drewes , Danny Dynka
- 申请人: Eric R. Blomiley , Nirmal Ramaswamy , Ross S. Dando , Joel A. Drewes , Danny Dynka
- 申请人地址: US ID Boise
- 专利权人: Micron Technology, Inc.
- 当前专利权人: Micron Technology, Inc.
- 当前专利权人地址: US ID Boise
- 代理机构: Wells St. John P.S.
- 主分类号: C23C8/00
- IPC分类号: C23C8/00 ; C23C16/00
摘要:
In one implementation, a substrate susceptor for receiving a semiconductor substrate for selective epitaxial silicon-comprising depositing thereon, where the depositing comprises measuring emissivity of the susceptor from at least one susceptor location in a non-contacting manner, includes a body having a front substrate receiving side, a back side, and a peripheral edge. At least one susceptor location from which emissivity is to be measured is received on at least one of the front substrate receiving side, the back side, and the edge. Such at least one susceptor location comprises an outermost surface comprising a material upon which selective epitaxial silicon will not deposit upon during selective epitaxial silicon depositing on a semiconductor substrate received by the susceptor for at least an initial thickness of epitaxial silicon depositing on said substrate. Other aspects and implementations are contemplated.
公开/授权文献
信息查询
IPC分类: