发明授权
- 专利标题： Methods for the deposition of conductive electronic features
- 专利标题（中）： 导电电子特征沉积方法
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申请号： US10265179申请日： 2002-10-04
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公开(公告)号： US07629017B2公开(公告)日： 2009-12-08
- 发明人: Toivo T. Kodas , Mark J. Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron D. Stump , Allen B. Schult , Paolina Atanassova , Klaus Kunze
- 申请人： Toivo T. Kodas , Mark J. Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron D. Stump , Allen B. Schult , Paolina Atanassova , Klaus Kunze
- 申请人地址： US MA Boston
- 专利权人： Cabot Corporation
- 当前专利权人： Cabot Corporation
- 当前专利权人地址： US MA Boston
- 代理机构： Marsh Fischmann & Breyfogle LLP
- 主分类号： B05D5/12
- IPC分类号： B05D5/12 ; B05D3/02
摘要：
A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a low viscosity enabling deposition using direct-write tools. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes copper metal for the formation of highly conductive copper features.
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