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公开(公告)号：US07629017B2
公开(公告)日：2009-12-08
申请号：US10265179
申请日：2002-10-04
申请人： Toivo T. Kodas , Mark J. Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron D. Stump , Allen B. Schult , Paolina Atanassova , Klaus Kunze
发明人： Toivo T. Kodas , Mark J. Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron D. Stump , Allen B. Schult , Paolina Atanassova , Klaus Kunze
摘要： A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a low viscosity enabling deposition using direct-write tools. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes copper metal for the formation of highly conductive copper features.
摘要翻译： 用于沉积和形成诸如导电特征的电特征的前体组合物。 前体组合物有利地具有低粘度，使得能够使用直接写入工具进行沉积。 前体组合物还具有低的转化温度，使得能够沉积并转化成低温基底上的电特征。 特别优选的前体组合物包括用于形成高导电性铜特征的铜金属。
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2.发明申请Low viscosity precursor compositions and methods for the deposition of conductive electronic features 审中-公开低粘度前体组合物和沉积导电电子特征的方法公开(公告)号：US20100034986A1
公开(公告)日：2010-02-11
申请号：US11642692
申请日：2006-12-21
申请人： Toivo T. Kodas , Mark J. Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron D. Stump , Allen B. Schult , Paolina Atanassova , Klaus Kunze
发明人： Toivo T. Kodas , Mark J. Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron D. Stump , Allen B. Schult , Paolina Atanassova , Klaus Kunze
IPC分类号： B05D5/12
CPC分类号： H05K3/105 , C23C18/06 , C23C18/08 , H01B1/026 , H01L24/03 , H01L24/05 , H01L2224/05294 , H01L2224/053 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H05K1/097 , H05K2201/0154 , H05K2203/1131 , H01L2924/00
摘要： A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a low viscosity enabling deposition using direct-write tools. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes silver metal for the formation of highly conductive silver features.
摘要翻译： 用于沉积和形成诸如导电特征的电特征的前体组合物。 前体组合物有利地具有低粘度，使得能够使用直接写入工具进行沉积。 前体组合物还具有低的转化温度，使得能够沉积并转化成低温基底上的电特征。 特别优选的前体组合物包含用于形成高导电性银特征的银金属。
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3.发明授权Precursor compositions and methods for the deposition of passive electrical components on a substrate 失效用于将无源电组件沉积在衬底上的前体组合物和方法公开(公告)号：US07524528B2
公开(公告)日：2009-04-28
申请号：US10265070
申请日：2002-10-04
申请人： Toivo T. Kodas , Mark J. Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron D. Stump , Allen B. Schult , Paolina Atanassova , Klaus Kunze
发明人： Toivo T. Kodas , Mark J. Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron D. Stump , Allen B. Schult , Paolina Atanassova , Klaus Kunze
CPC分类号： H01L21/02205 , B33Y10/00 , B33Y70/00 , B33Y80/00 , C09D11/30 , C23C18/06 , C23C18/08 , H01B1/026 , H01C17/06506 , H01C17/06533 , H01C17/06573 , H01G4/1227 , H01G4/1254 , H01L21/02255 , H01L21/02282 , H01L21/02288 , H01L21/288 , H01L21/31691 , H05K1/0346 , H05K1/097 , H05K1/162 , H05K1/167 , H05K3/105 , H05K3/125 , H05K2203/013 , H05K2203/1142 , Y10T29/49099
摘要： Precursor compositions for the deposition of electronic features such as resistors and dielectric components and methods for the deposition of the precursor compositions. The precursor compositions have a low viscosity, such as not greater than about 1000 centipoise and can be deposited using a direct-write tool. The precursors also have a low conversion temperature, enabling the formation of electronic features on a wide variety of substrates, including low temperature substrates.
摘要翻译： 用于沉积诸如电阻器和电介质组分的电子特征的前体组合物和沉积前体组合物的方法。 前体组合物具有低粘度，例如不大于约1000厘泊，并且可以使用直写工具进行沉积。 前体还具有低的转化温度，使得能够在各种基材上形成电子特征，包括低温底物。
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公开(公告)号：US07732002B2
公开(公告)日：2010-06-08
申请号：US10274495
申请日：2002-10-18
申请人： Toivo T. Kodas , Mark J. Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron D. Stump , Allen B. Schult , Paolina Atanassova , Klaus Kunze
发明人： Toivo T. Kodas , Mark J. Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron D. Stump , Allen B. Schult , Paolina Atanassova , Klaus Kunze
摘要： Precursor compositions in the form of a tape that can be transferred to a substrate and converted to an electronic feature at a relatively low temperature, such as not greater than about 200° C. The tape composition can be disposed on a carrier to form a ribbon structure that is flexible and can be handled in a variety of industrial processes.
摘要翻译： 胶带形式的前体组合物可以转移到基底并在相对低的温度例如不大于约200℃下转化成电子特征。胶带组合物可以设置在载体上以形成带状物 结构灵活，可以在各种工业过程中处理。
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公开(公告)号：US07691664B2
公开(公告)日：2010-04-06
申请号：US11642664
申请日：2006-12-21
申请人： Toivo T. Kodas , Mark J. Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron D. Stump , Allen B. Schult , Paolina Atanassova , Klaus Kunze
发明人： Toivo T. Kodas , Mark J. Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron D. Stump , Allen B. Schult , Paolina Atanassova , Klaus Kunze
IPC分类号： H01L21/00
CPC分类号： H05K3/105 , C23C18/06 , C23C18/08 , H01B1/026 , H01L24/03 , H01L24/05 , H01L2224/05294 , H01L2224/053 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H05K1/097 , H05K2201/0154 , H05K2203/1131 , H01L2924/00
摘要： A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a low viscosity enabling deposition using direct-write tools. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes silver metal for the formation of highly conductive silver features.
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公开(公告)号：US20080108218A1
公开(公告)日：2008-05-08
申请号：US11642664
申请日：2006-12-21
申请人： Toivo T. Kodas , Mark J. Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron D. Stump , Allen B. Schult , Paolina Atanassova , Klaus Kunze
发明人： Toivo T. Kodas , Mark J. Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron D. Stump , Allen B. Schult , Paolina Atanassova , Klaus Kunze
IPC分类号： H01L21/44
CPC分类号： H05K3/105 , C23C18/06 , C23C18/08 , H01B1/026 , H01L24/03 , H01L24/05 , H01L2224/05294 , H01L2224/053 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H05K1/097 , H05K2201/0154 , H05K2203/1131 , H01L2924/00
摘要： A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a low viscosity enabling deposition using direct-write tools. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes silver metal for the formation of highly conductive silver features.
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公开(公告)号：US20100112195A1
公开(公告)日：2010-05-06
申请号：US10274495
申请日：2002-10-18
申请人： Toivo T. Kodas , Mark J. Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron D. Stump , Allen B. Schult , Paolina Atanassova , Klaus Kunze
发明人： Toivo T. Kodas , Mark J. Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron D. Stump , Allen B. Schult , Paolina Atanassova , Klaus Kunze
摘要： Precursor compositions in the form of a tape that can be transferred to a substrate and converted to an electronic feature at a relatively low temperature, such as not greater than about 200° C. The tape composition can be disposed on a carrier to form a ribbon structure that is flexible and can be handled in a variety of industrial processes.
摘要翻译： 胶带形式的前体组合物可以转移到基底并在相对低的温度例如不大于约200℃下转化成电子特征。胶带组合物可以设置在载体上以形成带状物 结构灵活，可以在各种工业过程中处理。
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公开(公告)号：US07553512B2
公开(公告)日：2009-06-30
申请号：US10286363
申请日：2002-11-01
申请人： Toivo T. Kodas , Mark J. Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron D. Stump , Allen B. Schult , Paolina Atanassova , Klaus Kunze
发明人： Toivo T. Kodas , Mark J. Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron D. Stump , Allen B. Schult , Paolina Atanassova , Klaus Kunze
CPC分类号： H05K1/167 , B33Y10/00 , B33Y80/00 , C09D11/30 , H01C17/06506 , H01C17/06533 , H01C17/06573 , H01L21/288 , H01L21/31691 , H05K1/0346 , H05K1/097 , H05K1/162 , H05K3/105 , H05K3/125 , H05K2203/013 , H05K2203/1142 , H05K2203/121 , H05K2203/125
摘要： Precursor compositions for the fabrication of electronic features such as resistors and capacitors. The precursor compositions are formulated to have a low conversion temperature, such as not greater than about 350° C., thereby enabling the fabrication of such electronic features on a variety of substrates, including organic substrates such as polymer substrates.
摘要翻译： 用于制造诸如电阻器和电容器的电子特征的前体组合物。 将前体组合物配制成具有低转化温度，例如不大于约350℃，从而使得能够在各种基材上制造这样的电子特征，包括有机基底如聚合物基底。
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9.发明授权公开(公告)号：US06951666B2
公开(公告)日：2005-10-04
申请号：US10265296
申请日：2002-10-04
申请人： Toivo T. Kodas , Mark J. Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron D. Stump , Allen B. Schult , Paolina Atanassova , Klaus Kunze
发明人： Toivo T. Kodas , Mark J. Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron D. Stump , Allen B. Schult , Paolina Atanassova , Klaus Kunze
IPC分类号： C09D11/00 , H01B1/02 , H01C17/065 , H01L21/288 , H01L21/314 , H01L21/316 , H05K1/09 , H05K3/10 , B05D3/02
CPC分类号： H01C17/06506 , C09D11/30 , C23C18/08 , H01B1/026 , H01C17/06533 , H01C17/06573 , H01L21/288 , H01L21/31691 , H05K1/097 , H05K3/105
摘要： A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a viscosity of at least about 1000 centipoise and can be deposited by screen printing. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes silver and/or copper metal for the formation of highly conductive features.
摘要翻译： 用于沉积和形成诸如导电特征的电特征的前体组合物。 前体组合物有利地具有至少约1000厘泊的粘度，并且可以通过丝网印刷沉积。 前体组合物还具有低的转化温度，使得能够沉积并转化成低温基底上的电特征。 特别优选的前体组合物包括用于形成高导电特征的银和/或铜金属。
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公开(公告)号：US20110303885A1
公开(公告)日：2011-12-15
申请号：US12816210
申请日：2010-06-15
申请人： Karel Vanheusden , Klaus Kunze , Hyungrak Kim , Aaron D. Stump , Allen B. Schult , Mark J. Hampden-Smith , Chuck Edwards , Anthony R. James , James Caruso , Toivo T. Kodas , Scott Thomas Haubrich , Mark H. Kowalski
发明人： Karel Vanheusden , Klaus Kunze , Hyungrak Kim , Aaron D. Stump , Allen B. Schult , Mark J. Hampden-Smith , Chuck Edwards , Anthony R. James , James Caruso , Toivo T. Kodas , Scott Thomas Haubrich , Mark H. Kowalski
IPC分类号： H01B1/22
CPC分类号： H01B1/02 , B82Y30/00 , H01B1/22 , Y10S977/773 , Y10S977/81
摘要： A metal nanoparticle composition for the fabrication of conductive features. The metal nanoparticle composition advantageously has a low viscosity permitting deposition of the composition by direct-write tools. The metal nanoparticle composition advantageously also has a low conversion temperature, permitting its deposition and conversion to an electrical feature on polymeric substrates.
摘要翻译： 用于制造导电特征的金属纳米颗粒组合物。 金属纳米颗粒组合物有利地具有低粘度，允许通过直写工具沉积组合物。 金属纳米颗粒组合物有利地还具有低转化温度，允许其沉积并转化成聚合物基底上的电特征。
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