发明授权
US07635418B2 Plasma processing apparatus and methods for removing extraneous material from selected areas on a substrate
有权
等离子体处理装置和从衬底上的选定区域去除外来材料的方法
- 专利标题: Plasma processing apparatus and methods for removing extraneous material from selected areas on a substrate
- 专利标题(中): 等离子体处理装置和从衬底上的选定区域去除外来材料的方法
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申请号: US11003062申请日: 2004-12-03
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公开(公告)号: US07635418B2公开(公告)日: 2009-12-22
- 发明人: Robert S. Condrashoff , James D. Getty , James S. Tyler
- 申请人: Robert S. Condrashoff , James D. Getty , James S. Tyler
- 申请人地址: US OH Westlake
- 专利权人: Nordson Corporation
- 当前专利权人: Nordson Corporation
- 当前专利权人地址: US OH Westlake
- 代理机构: Wood, Herron & Evans LLP
- 主分类号: H01L21/306
- IPC分类号: H01L21/306 ; C23C16/00 ; C23C16/04
摘要:
Apparatus and methods for shielding a feature projecting from a first area on a substrate to a plasma while simultaneously removing extraneous material from a different area on the substrate with the plasma. The apparatus includes at least one concavity positioned and dimensioned to receive the feature such that the feature is shielded from the plasma. The apparatus further includes a window through which the plasma removes the extraneous material. The method generally includes removing the extraneous material while shielding the feature against plasma exposure.
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