发明授权
- 专利标题： Bonding interface quality by cold cleaning and hot bonding
- 专利标题（中）： 通过冷清和热粘合粘合界面质量
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申请号： US11873311申请日： 2007-10-16
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公开(公告)号： US07645682B2公开(公告)日： 2010-01-12
- 发明人: Sebastien Kerdiles , Willy Michel , Walter Schwarzenbach , Daniel Delprat
- 申请人： Sebastien Kerdiles , Willy Michel , Walter Schwarzenbach , Daniel Delprat
- 申请人地址： FR Bernin
- 专利权人： S.O.I.Tec Silicon on Insulator Technologies
- 当前专利权人： S.O.I.Tec Silicon on Insulator Technologies
- 当前专利权人地址： FR Bernin
- 代理机构： Winston & Strawn LLP
- 优先权： FR0753318 20070216
- 主分类号： H01L21/76
- IPC分类号： H01L21/76 ; H01L21/46 ; H01L21/30 ; H01L21/461
摘要：
The invention relates to improvements in a method for molecularly bonding first and second substrates together by placing them in surface to surface contact. The improvement includes, prior to placing the substrates in contact, cleaning the surface of one or both of the substrates in a manner to provide a cleaned surface that is slightly roughened compared to a conventionally polished surface, and heating at least one or both of the substrates prior to placing the substrates in contact while retaining the heating at least until the substrates are in surface to surface contact.