Invention Grant
US07649779B2 Integrated circuits; methods for manufacturing an integrated circuit; memory modules; computing systems
有权
集成电路; 集成电路制造方法; 内存模块; 计算系统
- Patent Title: Integrated circuits; methods for manufacturing an integrated circuit; memory modules; computing systems
- Patent Title (中): 集成电路; 集成电路制造方法; 内存模块; 计算系统
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Application No.: US11749028Application Date: 2007-05-15
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Publication No.: US07649779B2Publication Date: 2010-01-19
- Inventor: Eike Ruttkowski , Detlev Richter , Michael Specht , Joseph Willer , Dirk Manger , Kenny Oisin , Steffen Meyer , Klaus Knobloch , Holger Moeller , Doris Keitel Schulz , Jan Gutsche , Gert Koebernik , Christoph Friederich
- Applicant: Eike Ruttkowski , Detlev Richter , Michael Specht , Joseph Willer , Dirk Manger , Kenny Oisin , Steffen Meyer , Klaus Knobloch , Holger Moeller , Doris Keitel Schulz , Jan Gutsche , Gert Koebernik , Christoph Friederich
- Applicant Address: DE Munich DE Dresden
- Assignee: Qimonda AG,Qimonda Flash GmbH
- Current Assignee: Qimonda AG,Qimonda Flash GmbH
- Current Assignee Address: DE Munich DE Dresden
- Agency: Slater & Matsil, L.L.P.
- Main IPC: G11C16/00
- IPC: G11C16/00
Abstract:
Embodiments of the present invention relate generally to integrated circuits, methods for manufacturing an integrated circuit, memory modules, and computing systems.
Public/Granted literature
- US20080285344A1 Integrated Circuits; Methods for Manufacturing an Integrated Circuit; Memory Modules; Computing Systems Public/Granted day:2008-11-20
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