发明授权
- 专利标题： Submounts for semiconductor light emitting device packages and semiconductor light emitting device packages including the same
- 专利标题（中）： 用于半导体发光器件封装的底座以及包括其的半导体发光器件封装
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申请号： US11412381申请日： 2006-04-27
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公开(公告)号： US07655957B2公开(公告)日： 2010-02-02
- 发明人: Ban P. Loh , Nicholas Medendorp, Jr. , Bernd Keller
- 申请人： Ban P. Loh , Nicholas Medendorp, Jr. , Bernd Keller
- 申请人地址： US NC Durham
- 专利权人： Cree, Inc.
- 当前专利权人： Cree, Inc.
- 当前专利权人地址： US NC Durham
- 代理机构： Myers Bigel Sibley & Sajovec
- 主分类号： H01L29/22
- IPC分类号： H01L29/22 ; H01L23/48
摘要：
A submount for a solid state lighting package includes a support member having upper and lower surfaces, a first side surface, and a second side surface opposite the first side surface, a first electrical bondpad on the upper surface of the support member and having a first bonding region proximate the first side surface of the support member and a second bonding region extending toward the second side surface of the support member, and a second electrical bondpad on the upper surface of the support member having a die mounting region proximate the first side surface of the support member and an extension region extending toward the second side surface of the support member. The die mounting region of the second electrical bondpad may be configured to receive an electronic device. The submount further includes a third electrical bondpad on the upper surface of the support member and positioned between the second side surface of the support member and the die mounting region of the second electrical bondpad.
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