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1.发明申请LED LAMP OR BULB WITH REMOTE PHOSPHOR AND DIFFUSER CONFIGURATION WITH ENHANCED SCATTERING PROPERTIES 有权带有远程磷光体的LED灯或灯泡和具有增强散射特性的差分配置公开(公告)号：US20110267801A1
公开(公告)日：2011-11-03
申请号：US13018291
申请日：2011-01-31
申请人： Tao Tong , Ronan Le Toquin , Bernd Keller , Eric Tarsa , Mark Youmans , Theodore Lowes , Nicholas Medendorp, JR. , Antony van de Ven , Gerald Negley
发明人： Tao Tong , Ronan Le Toquin , Bernd Keller , Eric Tarsa , Mark Youmans , Theodore Lowes , Nicholas Medendorp, JR. , Antony van de Ven , Gerald Negley
CPC分类号： F21V9/30 , F21K9/232 , F21K9/64 , F21V3/00 , F21V3/02 , F21V29/505 , F21V29/767 , F21V29/773 , F21Y2115/10
摘要： An LED lamp or bulb is disclosed that comprises a light source, a heat sink structure and an optical cavity. The optical cavity comprises a phosphor carrier having a conversions material and arranged over an opening to the cavity. The phosphor carrier comprises a thermally conductive transparent material and is thermally coupled to the heat sink structure. An LED based light source is mounted in the optical cavity remote to the phosphor carrier with light from the light source passing through the phosphor carrier. A diffuser dome is included that is mounted over the optical cavity, with light from the optical cavity passing through the diffuser dome. The properties of the diffuser, such as geometry, scattering properties of the scattering layer, surface roughness or smoothness, and spatial distribution of the scattering layer properties may be used to control various lamp properties such as color uniformity and light intensity distribution as a function of viewing angle.
摘要翻译： 公开了一种LED灯或灯泡，其包括光源，散热结构和光学腔。 光学腔包括具有转换材料的荧光体载体并且布置在通向空腔的开口上。 荧光体载体包括导热透明材料并且热耦合到散热器结构。 基于LED的光源通过来自光源的光穿过荧光体载体而安装在远离荧光体载体的光学腔中。 包括安装在光学腔上的扩散器圆顶，来自光学腔的光通过扩散器圆顶。 扩散器的性质，如几何形状，散射层的散射特性，表面粗糙度或平滑度以及散射层性质的空间分布可用于控制各种灯具性能，如颜色均匀性和光强度分布，作为 可视角度。
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公开(公告)号：US20100109029A1
公开(公告)日：2010-05-06
申请号：US12685883
申请日：2010-01-12
IPC分类号： H01L33/00
CPC分类号： H01L25/0753 , F21K9/00 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/19107 , H01L2924/00014
摘要： A submount for a solid state lighting package includes a support member having upper and lower surfaces, a first side surface, and a second side surface opposite the first side surface, a first electrical bondpad on the upper surface of the support member and having a first bonding region proximate the first side surface of the support member and a second bonding region extending toward the second side surface of the support member, and a second electrical bondpad on the upper surface of the support member having a die mounting region proximate the first side surface of the support member and an extension region extending toward the second side surface of the support member. The die mounting region of the second electrical bondpad may be configured to receive an electronic device. The submount further includes a third electrical bondpad on the upper surface of the support member and positioned between the second side surface of the support member and the die mounting region of the second electrical bondpad.
摘要翻译： 一种用于固体照明包装的基座，包括具有上表面和下表面的支撑构件，第一侧表面和与第一侧表面相对的第二侧表面，位于支撑构件的上表面上的第一电接合垫， 接合区域靠近支撑构件的第一侧表面，以及第二接合区域，其朝着支撑构件的第二侧表面延伸，并且在支撑构件的上表面上的第二电接合板具有靠近第一侧表面的模具安装区域 并且延伸到所述支撑构件的第二侧表面的延伸区域。 第二电接合板的管芯安装区域可以被配置为接收电子设备。 底座还包括位于支撑构件的上表面上并位于支撑构件的第二侧表面和第二电接合垫的模具安装区域之间的第三电接合板。
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4.发明授权Submounts for semiconductor light emitting device packages and semiconductor light emitting device packages including the same 有权用于半导体发光器件封装的底座以及包括其的半导体发光器件封装公开(公告)号：US07655957B2
公开(公告)日：2010-02-02
申请号：US11412381
申请日：2006-04-27
CPC分类号： H01L25/0753 , F21K9/00 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/19107 , H01L2924/00014
摘要： A submount for a solid state lighting package includes a support member having upper and lower surfaces, a first side surface, and a second side surface opposite the first side surface, a first electrical bondpad on the upper surface of the support member and having a first bonding region proximate the first side surface of the support member and a second bonding region extending toward the second side surface of the support member, and a second electrical bondpad on the upper surface of the support member having a die mounting region proximate the first side surface of the support member and an extension region extending toward the second side surface of the support member. The die mounting region of the second electrical bondpad may be configured to receive an electronic device. The submount further includes a third electrical bondpad on the upper surface of the support member and positioned between the second side surface of the support member and the die mounting region of the second electrical bondpad.
摘要翻译： 一种用于固体照明包装的基座，包括具有上表面和下表面的支撑构件，第一侧表面和与第一侧表面相对的第二侧表面，位于支撑构件的上表面上的第一电接合垫， 接合区域靠近支撑构件的第一侧表面，以及第二接合区域，其朝着支撑构件的第二侧表面延伸，并且在支撑构件的上表面上的第二电接合板具有靠近第一侧表面的模具安装区域 并且延伸到所述支撑构件的第二侧表面的延伸区域。 第二电接合板的管芯安装区域可以被配置为接收电子设备。 底座还包括位于支撑构件的上表面上并位于支撑构件的第二侧表面和第二电接合垫的模具安装区域之间的第三电接合板。
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公开(公告)号：US09070850B2
公开(公告)日：2015-06-30
申请号：US11982275
申请日：2007-10-31
CPC分类号： H01L33/62 , H01L33/54 , H01L33/64 , H01L33/647 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2924/01019 , H01L2924/01087 , H01L2924/00014 , H01L2924/00
摘要： An LED package includes a submount having a top and bottom surface with a plurality of top electrically and thermally conductive elements on its top surface. An LED is included on one of the top elements such that an electrical signal applied to the top elements causes the LED to emit light. The electrically conductive elements also spread heat from the LED across the majority of the submount top surface. A bottom thermally conductive element is included on the bottom surface of said submount and spreads heat from the submount, and a lens is formed directly over the LED. A method for fabricating LED packages includes providing a submount panel sized to be separated into a plurality of LED package submounts. Top conductive elements are formed on one surface of the submount panel for a plurality of LED packages, and LEDs are attached to the top elements. Lenses are molded over the LEDs and the substrate panel is singulated to separate it into a plurality of LED packages.
摘要翻译： LED封装包括其顶表面和底表面的底座，其顶表面上具有多个顶部导电和导热元件。 顶部元件之一中包括LED，使得施加到顶部元件的电信号使得LED发光。 导电元件还将散热的LED从跨越大多数的底座顶面传播。 底部导热元件包括在所述底座的底表面上并且从底座散热，并且在LED上直接形成透镜。 一种制造LED封装的方法包括提供尺寸被分成多个LED封装底座的底座面板。 顶部导电元件形成在用于多个LED封装的基座面板的一个表面上，并且LED附接到顶部元件。 在LED上模制透镜，并且衬底面板被分割成多个LED封装。
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公开(公告)号：US08378374B2
公开(公告)日：2013-02-19
申请号：US12685883
申请日：2010-01-12
CPC分类号： H01L25/0753 , F21K9/00 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/19107 , H01L2924/00014
摘要： A submount for a solid state lighting package includes a support member having upper and lower surfaces, a first side surface, and a second side surface opposite the first side surface, a first electrical bondpad on the upper surface of the support member and having a first bonding region proximate the first side surface of the support member and a second bonding region extending toward the second side surface of the support member, and a second electrical bondpad on the upper surface of the support member having a die mounting region proximate the first side surface of the support member and an extension region extending toward the second side surface of the support member. The die mounting region of the second electrical bondpad may be configured to receive an electronic device. The submount further includes a third electrical bondpad on the upper surface of the support member and positioned between the second side surface of the support member and the die mounting region of the second electrical bondpad.
摘要翻译： 一种用于固体照明包装的基座，包括具有上表面和下表面的支撑构件，第一侧表面和与第一侧表面相对的第二侧表面，位于支撑构件的上表面上的第一电接合垫， 接合区域靠近支撑构件的第一侧表面，以及第二接合区域，其朝着支撑构件的第二侧表面延伸，并且在支撑构件的上表面上的第二电接合板具有靠近第一侧表面的模具安装区域 并且延伸到所述支撑构件的第二侧表面的延伸区域。 第二电接合板的管芯安装区域可以被配置为接收电子设备。 底座还包括位于支撑构件的上表面上并位于支撑构件的第二侧表面和第二电接合垫的模具安装区域之间的第三电接合板。
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公开(公告)号：US20090108281A1
公开(公告)日：2009-04-30
申请号：US11982275
申请日：2007-10-31
IPC分类号： H01L33/00
CPC分类号： H01L33/62 , H01L33/54 , H01L33/64 , H01L33/647 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2924/01019 , H01L2924/01087 , H01L2924/00014 , H01L2924/00
摘要： An LED package comprising a submount having a top and bottom surface with a plurality of top electrically and thermally conductive elements on its top surface. An LED is included on one of the top elements such that an electrical signal applied to the top elements causes the LED to emit light. The electrically conductive elements also spread heat from the LED across the majority of the submount top surface. A bottom thermally conductive element is included on the bottom surface of said submount and spreads heat from the submount, and a lens is formed directly over the LED. A method for fabricating LED packages comprising providing a submount panel sized to be separated into a plurality of LED package submounts. Top conductive elements are formed on one surface of the submount panel for a plurality of LED packages, and LEDs are attached to the top elements. Lenses are molded over the LEDs and the substrate panel is singulated to separate it into a plurality of LED packages.
摘要翻译： 一种LED封装，包括具有在其顶表面上具有多个顶部导电和导热元件的顶表面和底表面的底座。 顶部元件之一中包括LED，使得施加到顶部元件的电信号使得LED发光。 导电元件还将散热的LED从跨越大多数的底座顶面传播。 底部导热元件包括在所述底座的底表面上并且从底座散热，并且在LED上直接形成透镜。 一种用于制造LED封装的方法，包括提供尺寸被分成多个LED封装底座的底座面板。 顶部导电元件形成在用于多个LED封装的基座面板的一个表面上，并且LED附接到顶部元件。 在LED上模制透镜，并且衬底面板被分割成多个LED封装。
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