Invention Grant
- Patent Title: Semiconductor device and method of manufacturing the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US11833019Application Date: 2007-08-02
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Publication No.: US07659573B2Publication Date: 2010-02-09
- Inventor: Young-ho Kim , Yong-kyu Lee , Myung-jo Chun
- Applicant: Young-ho Kim , Yong-kyu Lee , Myung-jo Chun
- Applicant Address: KR Suwon-Si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-Si
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2006-0075288 20060809
- Main IPC: H01L29/76
- IPC: H01L29/76

Abstract:
A semiconductor device includes a semiconductor substrate, source and drain regions formed on the semiconductor substrate, a recess channel that is formed on the inner surface of a recess region, which is formed on the semiconductor substrate between the source and drain regions, and in an epitaxial semiconductor film in which dopants are doped. The semiconductor device further includes a gate insulating film formed on the recess channel, and a gate electrode that fills the recess region and is formed on the gate insulating film.
Public/Granted literature
- US20080035962A1 Semiconductor Device And Method of Manufacturing the Same Public/Granted day:2008-02-14
Information query
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