An improved surface mounting method applied in a semiconductor package process is provided, wherein the method comprises the following steps: First a substrate having at least one pad set on one surface of the substrate is provided. Then a mask having at least one opening associated with one of the at least one pad is set on the substrate, wherein each opening is separated into a plurality of sub-openings by a segregator to expose the pad. Subsequently, a printing process is conducted to form a conductive layer on each pad. After removing the mask, a passive device is set on the conductive layer over the pad, and a heating treatment is conducted to fix the passive device on the pad.