公开(公告)号：US07662709B2

公开(公告)日：2010-02-16

申请号：US11617220

申请日：2006-12-28

Applicant: Pai-Chou Liu ,  Wen-Shin Lin ,  Sheng-Hong Cheng ,  Yu-Hsin Lee ,  Ming-Chia Hsieh ,  Kuan-Hung Yeh ,  Chia-Wei Chang ,  Tsung-Chi Chen

Inventor： Pai-Chou Liu ,  Wen-Shin Lin ,  Sheng-Hong Cheng ,  Yu-Hsin Lee ,  Ming-Chia Hsieh ,  Kuan-Hung Yeh ,  Chia-Wei Chang ,  Tsung-Chi Chen

IPC: H01L21/4763

CPC classification number: H05K3/3484 ,  H05K3/3442 ,  H05K2201/10636 ,  H05K2203/0545 ,  Y02P70/611 ,  Y02P70/613

Abstract: An improved surface mounting method applied in a semiconductor package process is provided, wherein the method comprises the following steps: First a substrate having at least one pad set on one surface of the substrate is provided. Then a mask having at least one opening associated with one of the at least one pad is set on the substrate, wherein each opening is separated into a plurality of sub-openings by a segregator to expose the pad. Subsequently, a printing process is conducted to form a conductive layer on each pad. After removing the mask, a passive device is set on the conductive layer over the pad, and a heating treatment is conducted to fix the passive device on the pad.

Abstract translation: 提供了一种应用于半导体封装工艺中的改进的表面安装方法，其中该方法包括以下步骤：首先提供在衬底的一个表面上具有至少一个衬垫的衬底。 然后，在衬底上设置具有至少一个与至少一个衬垫中的一个相关联的开口的掩模，其中通过分离器将每个开口分隔成多个子开口以露出衬垫。 随后，进行打印处理以在每个垫上形成导电层。 在去除掩模之后，在焊盘上的导电层上设置无源器件，并且进行加热处理以将无源器件固定在焊盘上。

公开(公告)号：US20120268601A1

公开(公告)日：2012-10-25

申请号：US13453443

申请日：2012-04-23

Applicant: Kuan-Hung YEH ,  Shun-Cheng HUNG

Inventor： Kuan-Hung YEH ,  Shun-Cheng HUNG

IPC: H04N7/18

CPC classification number: H04N7/188

Abstract: A method of recording traffic images is to be implemented in a drive recorder system. The method includes recording the traffic images at a first recording frame rate, generating a detection signal according to movement of the vehicle, searching a pre-stored table to acquire a vehicle driving condition matching with the detection signal, and recording the traffic images at a second recording frame rate when the acquired vehicle driving condition corresponds to an alert condition. The second recording frame rate is greater than the first recording frame rate.

Abstract translation: 记录业务图像的方法将在驱动记录器系统中实现。 该方法包括以第一记录帧速率记录业务图像，根据车辆的移动产生检测信号，搜索预先存储的表以获得与检测信号匹配的车辆行驶条件，并将业务图像记录在 所获取的车辆行驶条件对应于警报状态时的第二记录帧速率。 第二记录帧速率大于第一记录帧速率。

公开(公告)号：US20070254469A1

公开(公告)日：2007-11-01

申请号：US11617220

申请日：2006-12-28

Applicant: Pai-Chou Liu ,  Wen-Shin Lin ,  Sheng-Hong Cheng ,  Yu-Hsin Lee ,  Ming-Chia Hsieh ,  Kuan-Hung Yeh ,  Chia-Wei Chang ,  Tsung-Chi Chen

Inventor： Pai-Chou Liu ,  Wen-Shin Lin ,  Sheng-Hong Cheng ,  Yu-Hsin Lee ,  Ming-Chia Hsieh ,  Kuan-Hung Yeh ,  Chia-Wei Chang ,  Tsung-Chi Chen

IPC: H01L21/4763

CPC classification number: H05K3/3484 ,  H05K3/3442 ,  H05K2201/10636 ,  H05K2203/0545 ,  Y02P70/611 ,  Y02P70/613

Abstract: An improved surface mounting method applied in a semiconductor package process is provided, wherein the method comprises the following steps: First a substrate having at least one pad set on one surface of the substrate is provided. Then a mask having at least one opening associated with one of the at least one pad is set on the substrate, wherein each opening is separated into a plurality of sub-openings by a segregator to expose the pad. Subsequently, a printing process is conducted to form a conductive layer on each pad. After removing the mask, a passive device is set on the conductive layer over the pad, and a heating treatment is conducted to fix the passive device on the pad.

Abstract translation: 提供了一种应用于半导体封装工艺中的改进的表面安装方法，其中该方法包括以下步骤：首先提供在衬底的一个表面上具有至少一个衬垫的衬底。 然后，在衬底上设置具有至少一个与至少一个衬垫中的一个相关联的开口的掩模，其中通过分离器将每个开口分隔成多个子开口以露出衬垫。 随后，进行打印处理以在每个垫上形成导电层。 在去除掩模之后，在焊盘上的导电层上设置无源器件，并且进行加热处理以将无源器件固定在焊盘上。