公开(公告)号：US07728441B2

公开(公告)日：2010-06-01

申请号：US12003426

申请日：2007-12-26

Applicant: Pai-Chou Liu ,  Hsin-Fu Chuang

Inventor： Pai-Chou Liu ,  Hsin-Fu Chuang

IPC: H01L23/48

CPC classification number: H05K3/3484 ,  H05K3/3421 ,  H05K3/3452 ,  H05K2201/10689 ,  H05K2203/0545 ,  Y02P70/613 ,  Y10T428/24612

Abstract: A method for mounting a semiconductor package onto PCB is disclosed. A semiconductor package is provided, which comprises a plurality of outer terminals exposed out of an encapsulant. A PCB is provided and has a surface with a plurality of contact pads. Each contact pad has a first exposed side, an opposing exposed second side and a center between the exposed sides. A plurality of first pre-solders and a plurality of second pre-solders are formed on the surface by one single printing. The first pre-solders and the second pre-solders respectively cover the first and second exposed sides of the contact pads, spaces between the opposing first and second pre-solders expose the centers of the contact pads. Then the first and second pre-solders are reflowed and the semiconductor package is mounted on the PCB. When the outer terminals is connected to the contact pads, each first pre-solder and second pre-solder are flowed toward the corresponding exposed centers of the contact pad to prevent the fine pitch contact pads from bridging.

Abstract translation: 公开了一种将半导体封装安装到PCB上的方法。 提供一种半导体封装，其包括从密封剂露出的多个外部端子。 提供了PCB，并且具有多个接触垫的表面。 每个接触垫具有第一暴露侧，相对暴露的第二侧和暴露侧之间的中心。 通过一次打印在表面上形成多个第一预焊料和多个第二预焊料。 第一预焊料和第二预焊料分别覆盖接触焊盘的第一和第二暴露侧面，相对的第一和第二预焊料之间的空间暴露接触焊盘的中心。 然后将第一和第二预焊料回流，半导体封装安装在PCB上。 当外部端子连接到接触焊盘时，每个第一预焊料和第二预焊料朝向接触焊盘的相应的暴露的中心流动，以防止细间距接触焊盘的桥接。

公开(公告)号：US20070254469A1

公开(公告)日：2007-11-01

申请号：US11617220

申请日：2006-12-28

Applicant: Pai-Chou Liu ,  Wen-Shin Lin ,  Sheng-Hong Cheng ,  Yu-Hsin Lee ,  Ming-Chia Hsieh ,  Kuan-Hung Yeh ,  Chia-Wei Chang ,  Tsung-Chi Chen

Inventor： Pai-Chou Liu ,  Wen-Shin Lin ,  Sheng-Hong Cheng ,  Yu-Hsin Lee ,  Ming-Chia Hsieh ,  Kuan-Hung Yeh ,  Chia-Wei Chang ,  Tsung-Chi Chen

IPC: H01L21/4763

CPC classification number: H05K3/3484 ,  H05K3/3442 ,  H05K2201/10636 ,  H05K2203/0545 ,  Y02P70/611 ,  Y02P70/613

Abstract: An improved surface mounting method applied in a semiconductor package process is provided, wherein the method comprises the following steps: First a substrate having at least one pad set on one surface of the substrate is provided. Then a mask having at least one opening associated with one of the at least one pad is set on the substrate, wherein each opening is separated into a plurality of sub-openings by a segregator to expose the pad. Subsequently, a printing process is conducted to form a conductive layer on each pad. After removing the mask, a passive device is set on the conductive layer over the pad, and a heating treatment is conducted to fix the passive device on the pad.

Abstract translation: 提供了一种应用于半导体封装工艺中的改进的表面安装方法，其中该方法包括以下步骤：首先提供在衬底的一个表面上具有至少一个衬垫的衬底。 然后，在衬底上设置具有至少一个与至少一个衬垫中的一个相关联的开口的掩模，其中通过分离器将每个开口分隔成多个子开口以露出衬垫。 随后，进行打印处理以在每个垫上形成导电层。 在去除掩模之后，在焊盘上的导电层上设置无源器件，并且进行加热处理以将无源器件固定在焊盘上。

公开(公告)号：US07911056B2

公开(公告)日：2011-03-22

申请号：US11651540

申请日：2007-01-10

Applicant: Pai-Chou Liu ,  Yu-Hsin Lee

Inventor： Pai-Chou Liu ,  Yu-Hsin Lee

IPC: H01L23/48

CPC classification number: H05K3/3452 ,  H01L23/49816 ,  H01L23/49838 ,  H01L2224/05552 ,  H01L2224/05555 ,  H01L2224/05571 ,  H05K2201/0989 ,  H05K2201/10734 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A substrate structure having non-solder mask design (N-SMD) ball pads. The substrate structure includes a substrate and a solder mask. The substrate has a first surface, a trace layer and at least one ball pad. The ball pad and the trace layer are disposed on the first surface. The trace layer has a plurality of traces, and at least one trace electrically connects to the ball pad. The solder mask has at least one opening corresponding to the ball pad. The size of the opening is larger than that of the ball pad. The solder mask covers the trace connecting to the ball pad. The problem of non-alignment of the solder ball can thus be solved, and the hole in the solder ball can be prevented when the substrate structure is welded with a PCB so that the reliability of solder ball welding can be improved.

Abstract translation: 具有非焊锡掩模设计（N-SMD）球垫的衬底结构。 衬底结构包括衬底和焊接掩模。 基板具有第一表面，迹线层和至少一个球垫。 球垫和轨迹层设置在第一表面上。 迹线层具有多个迹线，并且至少一个轨迹电连接到球垫。 焊接掩模具有至少一个对应于球垫的开口。 开口的尺寸大于球垫的尺寸。 焊接掩模覆盖连接到球垫的迹线。 因此可以解决焊球不对准的问题，并且当用PCB焊接衬底结构时可以防止焊球中的孔，从而可以提高焊球焊接的可靠性。

公开(公告)号：US20080226877A1

公开(公告)日：2008-09-18

申请号：US12003426

申请日：2007-12-26

Applicant: Pai-Chou Liu ,  Hsin-Fu Chuang

Inventor： Pai-Chou Liu ,  Hsin-Fu Chuang

IPC: B32B3/00

CPC classification number: H05K3/3484 ,  H05K3/3421 ,  H05K3/3452 ,  H05K2201/10689 ,  H05K2203/0545 ,  Y02P70/613 ,  Y10T428/24612

Abstract: A method for mounting a semiconductor package onto PCB is disclosed. A semiconductor package is provided, which comprises a plurality of outer terminals exposed out of an encapsulant. A PCB is provided and has a surface with a plurality of contact pads. Each contact pad has a first exposed side, an opposing exposed second side and a center between the exposed sides. A plurality of first pre-solders and a plurality of second pre-solders are formed on the surface by one single printing. The first pre-solders and the second pre-solders respectively cover the first and second exposed sides of the contact pads, spaces between the opposing first and second pre-solders expose the centers of the contact pads. Then the first and second pre-solders are reflowed and the semiconductor package is mounted on the PCB. When the outer terminals is connected to the contact pads, each first pre-solder and second pre-solder are flowed toward the corresponding exposed centers of the contact pad to prevent the fine pitch contact pads from bridging.

Abstract translation: 公开了一种将半导体封装安装到PCB上的方法。 提供一种半导体封装，其包括从密封剂露出的多个外部端子。 提供了PCB，并且具有多个接触垫的表面。 每个接触垫具有第一暴露侧，相对暴露的第二侧和暴露侧之间的中心。 通过一次打印在表面上形成多个第一预焊料和多个第二预焊料。 第一预焊料和第二预焊料分别覆盖接触焊盘的第一和第二暴露侧面，相对的第一和第二预焊料之间的空间暴露接触焊盘的中心。 然后将第一和第二预焊料回流，半导体封装安装在PCB上。 当外部端子连接到接触焊盘时，每个第一预焊料和第二预焊料朝向接触焊盘的相应的暴露的中心流动，以防止细间距接触焊盘的桥接。

公开(公告)号：US07662709B2

公开(公告)日：2010-02-16

申请号：US11617220

申请日：2006-12-28

Applicant: Pai-Chou Liu ,  Wen-Shin Lin ,  Sheng-Hong Cheng ,  Yu-Hsin Lee ,  Ming-Chia Hsieh ,  Kuan-Hung Yeh ,  Chia-Wei Chang ,  Tsung-Chi Chen

Inventor： Pai-Chou Liu ,  Wen-Shin Lin ,  Sheng-Hong Cheng ,  Yu-Hsin Lee ,  Ming-Chia Hsieh ,  Kuan-Hung Yeh ,  Chia-Wei Chang ,  Tsung-Chi Chen

IPC: H01L21/4763

CPC classification number: H05K3/3484 ,  H05K3/3442 ,  H05K2201/10636 ,  H05K2203/0545 ,  Y02P70/611 ,  Y02P70/613

Abstract: An improved surface mounting method applied in a semiconductor package process is provided, wherein the method comprises the following steps: First a substrate having at least one pad set on one surface of the substrate is provided. Then a mask having at least one opening associated with one of the at least one pad is set on the substrate, wherein each opening is separated into a plurality of sub-openings by a segregator to expose the pad. Subsequently, a printing process is conducted to form a conductive layer on each pad. After removing the mask, a passive device is set on the conductive layer over the pad, and a heating treatment is conducted to fix the passive device on the pad.

Abstract translation: 提供了一种应用于半导体封装工艺中的改进的表面安装方法，其中该方法包括以下步骤：首先提供在衬底的一个表面上具有至少一个衬垫的衬底。 然后，在衬底上设置具有至少一个与至少一个衬垫中的一个相关联的开口的掩模，其中通过分离器将每个开口分隔成多个子开口以露出衬垫。 随后，进行打印处理以在每个垫上形成导电层。 在去除掩模之后，在焊盘上的导电层上设置无源器件，并且进行加热处理以将无源器件固定在焊盘上。

公开(公告)号：US07365422B2

公开(公告)日：2008-04-29

申请号：US11312461

申请日：2005-12-21

Applicant: Pai-Chou Liu ,  Jun-Cheng Liu ,  Kenneth Kinhang Ku ,  Yu-Li Chung

Inventor： Pai-Chou Liu ,  Jun-Cheng Liu ,  Kenneth Kinhang Ku ,  Yu-Li Chung

IPC: H01L23/10 ,  H05K7/20

CPC classification number: H01L23/4334 ,  H01L24/48 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A package of a leadframe with heatsinks, including a leadframe, a die, a first heatsink and a second heatsink. The leadframe has a die pad and a plurality of leads, and the leads are disposed around the die pad. The die is disposed on the die pad. The first heatsink is disposed on a first side of the leadframe and has a plurality of first positioning portions. The second heatsink is disposed on a second side of the leadframe. The second heatsink has a plurality of second positioning portions. The second positioning portions correspond to the first positioning portions of the first heatsink, whereby the warping problem of the leadframe is resolved.

Abstract translation: 具有散热器的引线框的封装，包括引线框，模具，第一散热器和第二散热器。 引线框架具有管芯焊盘和多个引线，并且引线设置在管芯焊盘周围。 芯片设置在芯片上。 第一散热器设置在引线框架的第一侧上并且具有多个第一定位部分。 第二散热器设置在引线框架的第二侧上。 第二散热器具有多个第二定位部。 第二定位部分对应于第一散热器的第一定位部分，由此解决引线框架的翘曲问题。

公开(公告)号：US07357294B2

公开(公告)日：2008-04-15

申请号：US10942789

申请日：2004-09-17

Applicant: Pai-Chou Liu ,  Hsin-Fu Chuang

Inventor： Pai-Chou Liu ,  Hsin-Fu Chuang

IPC: B23K31/02

CPC classification number: H05K3/3484 ,  H05K3/3421 ,  H05K3/3452 ,  H05K2201/10689 ,  H05K2203/0545 ,  Y02P70/613 ,  Y10T428/24612

Abstract: A method for mounting a semiconductor package onto PCB includes a semiconductor package comprising a plurality of outer terminals exposed out of an encapsulant. A PCB having a surface with a plurality of contact pads is provided. Each contact pad has a first exposed side, a second exposed side and a center between the exposed sides. A plurality of first pre-solders and second pre-solders are formed on the surface to cover the first and second exposed sides of the contact pads respectively, the centers of the contact pads between the first and second pre-solders being exposed. Then the first and second pre-solders are reflowed and the semiconductor package is mounted on the PCB. When the outer terminals are connected to the contact pads, each first pre-solder and second pre-solder are flowed toward the centers of the contact pad to prevent the fine pitch contact pads from bridging.

Abstract translation: 将半导体封装安装到PCB上的方法包括半导体封装，其包括从密封剂暴露出来的多个外部端子。 提供具有多个接触垫的表面的PCB。 每个接触垫具有第一暴露侧，第二暴露侧和暴露侧之间的中心。 在表面上形成多个第一预焊料和第二预焊料，以分别覆盖接触焊盘的第一和第二暴露侧，第一和第二预焊料之间的接触焊盘的中心露出。 然后将第一和第二预焊料回流，半导体封装安装在PCB上。 当外部端子连接到接触焊盘时，每个第一预焊接和第二预焊料朝向接触焊盘的中心流动，以防止细间距接触焊盘桥接。

公开(公告)号：US20080042278A1

公开(公告)日：2008-02-21

申请号：US11651540

申请日：2007-01-10

Applicant: Pai-Chou Liu ,  Yu-Hsin Lee

Inventor： Pai-Chou Liu ,  Yu-Hsin Lee

IPC: H01L23/48

CPC classification number: H05K3/3452 ,  H01L23/49816 ,  H01L23/49838 ,  H01L2224/05552 ,  H01L2224/05555 ,  H01L2224/05571 ,  H05K2201/0989 ,  H05K2201/10734 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: The present invention relates to a substrate structure having non-solder mask design (N-SMD) ball pads. The substrate structure comprises a substrate and a solder mask. The substrate has a first surface, a trace layer and at least one ball pad. The ball pad and the trace layer are disposed on the first surface. The trace layer has a plurality of traces, and at least one trace electrically connects to the ball pad. The solder mask has at least one opening corresponding the ball pad. The size of the opening is larger than that of the ball pad. The solder mask covers the trace connecting to the ball pad. By utilizing the substrate structure of the invention, the problem of non-alignment of the solder ball can be solved, and the hole in the solder ball can be prevented when the substrate structure is welded with a PCB so that the reliability of solder ball welding can be improved.

Abstract translation: 本发明涉及具有非阻焊掩模设计（N-SMD）球垫的衬底结构。 衬底结构包括衬底和焊接掩模。 基板具有第一表面，迹线层和至少一个球垫。 球垫和轨迹层设置在第一表面上。 迹线层具有多个迹线，并且至少一个轨迹电连接到球垫。 焊接掩模具有至少一个对应于球垫的开口。 开口的尺寸大于球垫的尺寸。 焊接掩模覆盖连接到球垫的迹线。 通过利用本发明的衬底结构，可以解决焊球不对准的问题，并且当衬底结构用PCB焊接时可以防止焊球中的孔，从而焊球焊接的可靠性 可以改进。

公开(公告)号：US20070069345A1

公开(公告)日：2007-03-29

申请号：US11312461

申请日：2005-12-21

Applicant: Pai-Chou Liu ,  Jun-Cheng Liu ,  Kenneth Ku ,  Yu-Li Chung

Inventor： Pai-Chou Liu ,  Jun-Cheng Liu ,  Kenneth Ku ,  Yu-Li Chung

IPC: H01L23/495

CPC classification number: H01L23/4334 ,  H01L24/48 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The present invention relates to a package of a leadframe with heatsinks. The package of the invention comprises a leadframe, a die, a first heatsink and a second heatsink. The leadframe has a die pad and a plurality of leads, and the leads are disposed around the die pad. The die is disposed on the die pad. The first heatsink is disposed on a first side of the leadframe and has a plurality of first positioning portions. The second heatsink is disposed on a second side of the leadframe. The second heatsink has a plurality of second positioning portions. The second positioning portions are corresponding to the first positioning portions of the first heatsink, whereby the warped problem of the leadframe will be resolved.

Abstract translation: 本发明涉及具有散热片的引线框的封装。 本发明的封装包括引线框架，模具，第一散热器和第二散热器。 引线框架具有管芯焊盘和多个引线，并且引线设置在管芯焊盘周围。 芯片设置在芯片上。 第一散热器设置在引线框架的第一侧上并且具有多个第一定位部分。 第二散热器设置在引线框架的第二侧上。 第二散热器具有多个第二定位部。 第二定位部分对应于第一散热器的第一定位部分，由此可以解决引线框架的翘曲问题。

公开(公告)号：US07180181B2

公开(公告)日：2007-02-20

申请号：US10933348

申请日：2004-09-03

Applicant: Pai-Chou Liu ,  Sheng-Tsung Liu ,  Wei-Chang Tai

Inventor： Pai-Chou Liu ,  Sheng-Tsung Liu ,  Wei-Chang Tai

IPC: H01L23/34 ,  H05K7/10

CPC classification number: H01L23/49894 ,  H01L24/81 ,  H01L2224/81801 ,  H01L2924/01087 ,  H05K3/3452 ,  H05K2201/10734 ,  H05K2203/0588

Abstract: A substrate is provided for carrying at least a semiconductor device. The substrate mainly includes a carrier body, a plurality of contact pads, a solder mask and a plurality of dams of a mesh. The contact pads are disposed on a surface of the carrier body and each has a bonding surface exposed out of the solder mask for connecting with the external terminals of the semiconductor device. The dams are disposed above the surface of the carrier body. The dams protrude from and located between the bonding surfaces of the contact pads to prevent solder paste, flux or the external terminals of the semiconductor device from bridging.

Abstract translation: 提供用于承载至少一个半导体器件的衬底。 基板主要包括载体主体，多个接触焊盘，焊接掩模和多个网状坝。 接触焊盘设置在载体主体的表面上，并且每个接触焊盘具有暴露在焊接掩模之外的接合表面，用于与半导体器件的外部端子连接。 坝体设置在承载体的表面上方。 大坝突出并位于接触垫的接合表面之间，以防止焊膏，焊剂或半导体器件的外部端子桥接。