Invention Grant
US07675160B2 Individual sub-assembly containing a ceramic interposer, silicon voltage regulator, and array capacitor
有权
包含陶瓷插入器，硅电压调节器和阵列电容器的单独子组件
- Patent Title: Individual sub-assembly containing a ceramic interposer, silicon voltage regulator, and array capacitor
- Patent Title (中): 包含陶瓷插入器，硅电压调节器和阵列电容器的单独子组件
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Application No.: US11648301Application Date: 2006-12-29
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Publication No.: US07675160B2Publication Date: 2010-03-09
- Inventor: Sriram Dattaguru , Larry Binder , Cengiz A. Palanduz , Chris Jones , Dave Bach , Kaladhar Radhakrishnan , Timothe Litt
- Applicant: Sriram Dattaguru , Larry Binder , Cengiz A. Palanduz , Chris Jones , Dave Bach , Kaladhar Radhakrishnan , Timothe Litt
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agent David L. Guglielmi
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
In some embodiments, an individual sub-assembly containing a ceramic interposer, silicon voltage regulator, and array capacitor is presented. In this regard, an apparatus is introduced having a table-shaped ceramic interposer containing conductive traces, a silicon voltage regulator coupled with contacts on a first surface of the ceramic interposer, and an array capacitor coupled with contacts on a second surface of the ceramic interposer. Other embodiments are also disclosed and claimed.
Public/Granted literature
- US20080157274A1 Individual sub-assembly containing a ceramic interposer, silicon voltage regulator, and array capacitor Public/Granted day:2008-07-03
Information query
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