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发明授权
US07682455B2 Device for storing and/or transporting plate-shaped substrates in the manufacture of electronic components 有权
用于在电子部件的制造中存储和/或传送板状基板的装置

Device for storing and/or transporting plate-shaped substrates in the manufacture of electronic components
摘要：
To make possible a tightly packed, essentially horizontal storage of wafers (40), in which a simplified access to each of these wafers (40) is possible, a device is provided having a plurality of superimposed storage elements (10). The storage elements (10) have device features (16) for depositing the wafers (40). The storage elements (10) have projections (14) for lifting, whereby a specific storage element (10a) as well as all storage elements (10) arranged above this specific storage element (10a) can be lifted by a predetermined first height for producing a contact gap. The projections (14) can also be used to lift the storage element (10b) arranged below the said storage element (10a) by a predetermined second height for producing a freedom of access.
摘要（中）：

为了使得可以紧密地包装，基本上水平地存储晶片（40），其中可以简化对这些晶片（40）的访问，具有多个叠加的存储元件（10）的装置。 存储元件（10）具有用于沉积晶片（40）的器件特征（16）。 存储元件（10）具有用于提升的突起（14），由此可以将特定存储元件（10a）以及布置在该特定存储元件（10a）上方的所有存储元件（10）提升预定的第一高度以产生 接触间隙。 突起（14）也可用于将布置在所述存储元件（10a）下方的存储元件（10b）提升预定的第二高度以产生进入自由度。

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