Invention Grant
- Patent Title: Techniques for providing decoupling capacitance
- Patent Title (中): 提供去耦电容的技术
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Application No.: US12056852Application Date: 2008-03-27
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Publication No.: US07691669B2Publication Date: 2010-04-06
- Inventor: Raymond R. Horton , John U. Knickerbocker , Edmund J. Sprogis , Cornelia K. Tsang
- Applicant: Raymond R. Horton , John U. Knickerbocker , Edmund J. Sprogis , Cornelia K. Tsang
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Ryan, Mason & Lewis, LLP
- Main IPC: H01L21/50
- IPC: H01L21/50 ; H01L21/48 ; H01L21/44 ; H01L21/8242
Abstract:
Techniques for electronic device fabrication are provided. In one aspect, an electronic device is provided. The electronic device comprises at least one interposer structure having one or more vias and a plurality of decoupling capacitors integrated therein, the at least one interposer structure being configured to allow for one or more of the plurality of decoupling capacitors to be selectively deactivated. In another aspect, a method of fabricating an electronic device comprising at least one interposer structure having one or more vias and a plurality of decoupling capacitors integrated therein comprises the following step. One or more of the plurality of decoupling capacitors are selectively deactivated.
Public/Granted literature
- US20080182359A1 TECHNIQUES FOR PROVIDING DECOUPLING CAPACITANCE Public/Granted day:2008-07-31
Information query
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