发明授权
- 专利标题： Method of forming a stack of heat generating integrated circuit chips with intervening cooling integrated circuit chips
- 专利标题（中）： 用中间冷却集成电路芯片形成一堆发热集成电路芯片的方法
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申请号： US11448232申请日： 2006-06-07
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公开(公告)号： US07696015B2公开(公告)日： 2010-04-13
- 发明人: Sarah E. Kim , R. Scott List , James G. Maveety , Alan M. Myers , Quat T. Vu
- 申请人： Sarah E. Kim , R. Scott List , James G. Maveety , Alan M. Myers , Quat T. Vu
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Trop, Pruner & Hu, P.C.
- 主分类号： H01L21/20
- IPC分类号： H01L21/20 ; H01L21/48 ; H01L21/44
摘要：
A stack of heat generating integrated circuit chips may be provided with intervening cooling integrated circuit chips. The cooling integrated circuit chips may include microchannels for the flow of the cooling fluid. The cooling fluid may be pumped using the integrated electroosmotic pumps. Removal of cooling fluid gases may be accomplished using integrated re-combiners in some embodiments.
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