发明授权
- 专利标题: Charged particle beam lithography apparatus and charged particle beam lithography method
- 专利标题(中): 带电粒子束光刻设备和带电粒子束光刻法
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申请号: US12204382申请日: 2008-09-04
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公开(公告)号: US07750324B2公开(公告)日: 2010-07-06
- 发明人: Susumu Oogi , Hitoshi Higurashi , Akihito Anpo , Toshiro Yamamoto
- 申请人: Susumu Oogi , Hitoshi Higurashi , Akihito Anpo , Toshiro Yamamoto
- 申请人地址: JP Numazu-shi
- 专利权人: NuFlare Technology, Inc.
- 当前专利权人: NuFlare Technology, Inc.
- 当前专利权人地址: JP Numazu-shi
- 代理机构: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- 优先权: JP2007-229853 20070905
- 主分类号: G21K5/10
- IPC分类号: G21K5/10 ; G21K5/00 ; H01J37/08
摘要:
A charged particle beam lithography apparatus includes a first block area divider configured to divide a pattern forming area into a plurality of first block areas in order to make a number of shots when forming a pattern substantially equal; an area density calculator configured to calculate, using a plurality of small areas obtained by virtually dividing the pattern forming area into mesh areas of a predetermined size smaller than all of the first block areas, a pattern area density of each small area positioned therein for each of the first block areas; a second block area divider configured to re-divide the pattern forming area divided into the plurality of first block areas into a plurality of second block areas of a uniform size, which is larger than the small area; a corrected dose calculator configured to calculate, using the pattern area density of each small area, a proximity effect-corrected dose in each corresponding small area positioned inside the second block area for each of the second block areas; a beam dose calculator configured to calculate, using the proximity effect-corrected dose of each small area, a beam dose of a charged particle beam in each corresponding small area; and a pattern generator configured to form a predetermined pattern on a target object by irradiating a charged particle beam of the beam dose calculated for each of the small areas.
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