发明授权
- 专利标题： Air Manifold for electronic module enclosure
- 专利标题（中）： 空气歧管用于电子模块外壳
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申请号： US12138186申请日： 2008-06-12
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公开(公告)号： US07755889B2公开(公告)日： 2010-07-13
- 发明人: Wade D. Vinson , David W. Sherrod , David W. Deis , Steve Novack
- 申请人： Wade D. Vinson , David W. Sherrod , David W. Deis , Steve Novack
- 申请人地址： US TX Houston
- 专利权人： Hewlett-Packard Development Company, L.P.
- 当前专利权人： Hewlett-Packard Development Company, L.P.
- 当前专利权人地址： US TX Houston
- 主分类号： G06F1/20
- IPC分类号： G06F1/20 ; H05K7/20 ; H05K5/00
摘要：
A central air manifold for an electronic module enclosure includes a front section and a rear section. The front section includes openings adapted to communicate with electronic modules and the rear section includes openings adapted to communicate with fans. The openings of the front section can be open when electronic modules are installed in the front section and the openings in the rear section can be open when operating fans are installed in the rear section.
公开/授权文献
- US20080316704A1 AIR MANIFOLD FOR ELECTRONIC MODULE ENCLOSURE 公开/授权日：2008-12-25
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