AIR MANIFOLD FOR ELECTRONIC MODULE ENCLOSURE
    1.
    发明申请
    AIR MANIFOLD FOR ELECTRONIC MODULE ENCLOSURE 有权
    电子模块外壳的空气歧管

    公开(公告)号:US20080316704A1

    公开(公告)日:2008-12-25

    申请号:US12138186

    申请日:2008-06-12

    IPC分类号: H05K7/20 H05K13/04

    摘要: A central air manifold for an electronic module enclosure includes a front section and a rear section. The front section includes openings adapted to communicate with electronic modules and the rear section includes openings adapted to communicate with fans. The openings of the front section can be open when electronic modules are installed in the front section and the openings in the rear section can be open when operating fans are installed in the rear section.

    摘要翻译: 用于电子模块外壳的中央空气歧管包括前部和后部。 前部包括适于与电子模块通信的开口,后部包括适于与风扇通信的开口。 当电子模块安装在前部时,前部的开口可以打开,而后部的风扇安装在后部时可以打开后部的开口。

    Air Manifold for electronic module enclosure
    2.
    发明授权
    Air Manifold for electronic module enclosure 有权
    空气歧管用于电子模块外壳

    公开(公告)号:US07755889B2

    公开(公告)日:2010-07-13

    申请号:US12138186

    申请日:2008-06-12

    IPC分类号: G06F1/20 H05K7/20 H05K5/00

    摘要: A central air manifold for an electronic module enclosure includes a front section and a rear section. The front section includes openings adapted to communicate with electronic modules and the rear section includes openings adapted to communicate with fans. The openings of the front section can be open when electronic modules are installed in the front section and the openings in the rear section can be open when operating fans are installed in the rear section.

    摘要翻译: 用于电子模块外壳的中央空气歧管包括前部和后部。 前部包括适于与电子模块通信的开口,后部包括适于与风扇通信的开口。 当电子模块安装在前部时,前部的开口可以打开,而后部的风扇安装在后部时可以打开后部的开口。