Invention Grant
- Patent Title: Substrate drying apparatus, substrate cleaning apparatus and substrate processing system
- Patent Title (中): 基板干燥装置,基板清洗装置及基板处理系统
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Application No.: US11475598Application Date: 2006-06-27
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Publication No.: US07766565B2Publication Date: 2010-08-03
- Inventor: Koji Kaneyama
- Applicant: Koji Kaneyama
- Applicant Address: JP Kyoto
- Assignee: Sokudo Co., Ltd.
- Current Assignee: Sokudo Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Townsend and Townsend and Crew LLP
- Priority: JP2005-194037 20050701; JP2005-194038 20050701
- Main IPC: G03D5/00
- IPC: G03D5/00 ; G03D3/08

Abstract:
A substrate processing system includes a substrate processing apparatus and a cleaning/drying apparatus. The substrate processing apparatus includes an indexer block, an anti-reflection film processing block, a resist film processing block, a development processing block, a resist cover film processing block, a resist cover film removal block and a first interface block. The cleaning/drying apparatus includes a cleaning/drying processing block and a second interface block. An exposure device is arranged adjacent to the second interface block. In the cleaning/drying processing block, cleaning processing is applied to a substrate before exposure processing and drying processing is applied to the substrate after the exposure processing.
Public/Granted literature
- US20070003278A1 Substrate drying apparatus, substrate cleaning apparatus and substrate processing system Public/Granted day:2007-01-04
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