Invention Grant
- Patent Title: Laminating roller assembly, credential substrate laminator and method of laminating a credential substrate
- Patent Title (中): 层压辊组件，认证基板层压机和层压凭证基板的方法
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Application No.: US11728589Application Date: 2007-03-26
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Publication No.: US07767050B2Publication Date: 2010-08-03
- Inventor: James R. Meier , Greg E. Gindele , Gan Zhao , Anthony L. Lokken , Chadwick M. Johnson , Matthew K. Dunham
- Applicant: James R. Meier , Greg E. Gindele , Gan Zhao , Anthony L. Lokken , Chadwick M. Johnson , Matthew K. Dunham
- Applicant Address: US CA Irvine
- Assignee: HID Global Corporation
- Current Assignee: HID Global Corporation
- Current Assignee Address: US CA Irvine
- Agency: Westman, Champlin & Kelly, P.A.
- Main IPC: B44C1/17
- IPC: B44C1/17 ; B32B37/00 ; B32B38/14 ; B32B41/00 ; B32B43/00 ; B30B9/20 ; B30B3/00 ; B29C65/02 ; B29C65/24
Abstract:
A laminating roller assembly comprises a frame, a movable support supported by the frame, a laminating roller and a lift mechanism. The laminating roller is attached to the movable support. The lift mechanism is attached to the frame and is configured to move the movable support and the attached laminating roller relative to the frame. Additional embodiments of the invention are directed to a credential substrate laminator and a method of laminating a credential substrate using a credential substrate laminator.
Public/Granted literature
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