Invention Grant
- Patent Title: Method for scribing substrate of brittle material and scriber
- Patent Title (中): 脆性材料和划线机基材划线方法
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Application No.: US10490323Application Date: 2002-09-20
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Publication No.: US07772522B2Publication Date: 2010-08-10
- Inventor: Masato Matsumoto , Tougo Gonoe
- Applicant: Masato Matsumoto , Tougo Gonoe
- Applicant Address: JP Osaka
- Assignee: Mitsuboshi Diamond Industrial Co., Ltd.
- Current Assignee: Mitsuboshi Diamond Industrial Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: Renner, Otto, Boisselle & Sklar, LLP
- Priority: JP2001-289620 20010921
- International Application: PCT/JP02/09742 WO 20020920
- International Announcement: WO03/026861 WO 20030403
- Main IPC: B23K26/00
- IPC: B23K26/00
Abstract:
A mother glass substrate is continuously heated by a first laser spot LS1 to a temperature which is lower than a softening point of the mother glass substrate, along a scribe line formation line SL on a surface of the mother glass substrate, along which a scribe line is to be formed, while an area close to the first laser spot LS1 is continuously cooled along the scribe line formation line SL; and an area which is close to the cooled area and is on an opposite side to the first laser spot LS1 is continuously heated by a second laser spot LS2 along the scribe line formation line SL to a temperature which is lower than the softening point of the mother glass substrate.
Public/Granted literature
- US20050029239A1 Method for scribing substrate of brittle material and scriber Public/Granted day:2005-02-10
Information query
