发明授权
- 专利标题: Semiconductor device and a method of manufacturing the same
- 专利标题(中): 半导体装置及其制造方法
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申请号: US11645577申请日: 2006-12-27
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公开(公告)号: US07791131B2公开(公告)日: 2010-09-07
- 发明人: Tomoyuki Miyake , Masatoshi Morikawa , Yutaka Hoshino , Makoto Hatori
- 申请人: Tomoyuki Miyake , Masatoshi Morikawa , Yutaka Hoshino , Makoto Hatori
- 申请人地址: JP Tokyo
- 专利权人: Renesas Electronics Corp.
- 当前专利权人: Renesas Electronics Corp.
- 当前专利权人地址: JP Tokyo
- 代理机构: Antonelli, Terry, Stout & Kraus, LLP.
- 优先权: JP2003-313971 20030905
- 主分类号: H01L29/76
- IPC分类号: H01L29/76 ; H01L29/94 ; H01L31/62 ; H01L31/113 ; H01L31/119
摘要:
To reduce the size and improve the power added efficiency of an RF power module having an amplifier element composed of a silicon power MOSFET, the on resistance and feedback capacitance, which were conventionally in a trade-off relationship, are reduced simultaneously by forming the structure of an offset drain region existing between a gate electrode and an n+ type drain region of the power MOSFET into a double offset one. More specifically, this is accomplished by adjusting the impurity concentration of an n− type offset drain region, which is closest to the gate electrode, to be relatively low and adjusting the impurity concentration of an n type offset drain region, which is distant from the gate electrode, to be relatively high.
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