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US07825468B2 Semiconductor packages, stacked semiconductor packages, and methods of manufacturing the semiconductor packages and the stacked semiconductor packages 有权
半导体封装，堆叠半导体封装以及制造半导体封装和堆叠半导体封装的方法

Semiconductor packages, stacked semiconductor packages, and methods of manufacturing the semiconductor packages and the stacked semiconductor packages
摘要：
A semiconductor package may include a semiconductor pattern, a bonding pad, and a polymer insulation member. The semiconductor pattern may include a semiconductor device and first hole. The bonding pad may include a wiring pattern and plug. The wiring pattern may be formed on an upper face of the semiconductor pattern. The plug may extend from the wiring pattern to fill the first hole. The polymer insulation member may be formed on a lower face of the semiconductor pattern and may include a second hole exposing a lower end of the plug. A method of manufacturing a semiconductor package may include forming a first hole through a semiconductor substrate; forming a bonding pad and plug; attaching a supporting member to the upper face of the substrate; reducing a thickness of the substrate; forming a polymer insulation member on the lower face of the substrate; and cutting the substrate.
摘要（中）：

半导体封装可以包括半导体图案，接合焊盘和聚合物绝缘构件。 半导体图案可以包括半导体器件和第一孔。 接合焊盘可以包括布线​​图案和插头。 布线图案可以形成在半导体图案的上表面上。 插头可以从布线图案延伸以填充第一孔。 聚合物绝缘构件可以形成在半导体图案的下表面上，并且可以包括暴露插头的下端的第二孔。 制造半导体封装的方法可以包括通过半导体衬底形成第一孔; 形成焊盘和插头; 将支撑构件附接到所述基板的上表面; 减小基板的厚度; 在所述基板的下表面上形成聚合物绝缘部件; 并切割基板。

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