发明授权
- 专利标题： Nickel plating solution and its preparation method, nickel plating method and printed wiring board copper foil
- 专利标题（中）： 镀镍液及其制备方法，镀镍法和印刷线路板铜箔
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申请号： US11524781申请日： 2006-09-21
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公开(公告)号： US07842397B2公开(公告)日： 2010-11-30
- 发明人: Yasuyuki Ito , Katsuyuki Matsumoto , Koji Nukaga , Yasuhiro Kusano , Kenji Yokomizo , Shingo Watanabe , Hiroyuki Ogawara , Katsumi Nomura
- 申请人： Yasuyuki Ito , Katsuyuki Matsumoto , Koji Nukaga , Yasuhiro Kusano , Kenji Yokomizo , Shingo Watanabe , Hiroyuki Ogawara , Katsumi Nomura
- 申请人地址： JP Tokyo
- 专利权人： Hitachi Cable, Ltd.
- 当前专利权人： Hitachi Cable, Ltd.
- 当前专利权人地址： JP Tokyo
- 代理机构： Scully, Scott, Murphy & Presser, P.C.
- 优先权： JP2005-280826 20050927; JP2006-159077 20060607
- 主分类号： B32B15/20
- IPC分类号： B32B15/20 ; H05K1/03 ; C25D3/12 ; C25D7/06
摘要：
A nickel plating solution preparation method has the steps of: dissolving in water 100 g/L or more and less than 200 g/L of nickel sulfate, and 10 g/L or more and less than 30 g/L of sodium citrate or 8 g/L or more and less than 25 g/L of citric acid, but adding no nickel chloride; and adjusting a pH of the resultant solution to 2 or more and less than 4. Another nickel plating solution preparation method has the steps of: dissolving in water 100 g/L or more and less than 200 g/L of nickel sulfate, and 10 g/L or more and less than 30 g/L of sodium citrate or 8 g/L or more and less than 25 g/L of citric acid, but adding no boric acid; and adjusting a pH of the resultant solution to 2 or more and less than 4.
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