公开(公告)号：US20070071999A1

公开(公告)日：2007-03-29

申请号：US11524781

申请日：2006-09-21

申请人： Yasuyuki Ito ,  Katsuyuki Matsumoto ,  Koji Nukaga ,  Yasuhiro Kusano ,  Kenji Yokomizo ,  Shingo Watanabe ,  Hiroyuki Ogawara ,  Katsumi Nomura

发明人： Yasuyuki Ito ,  Katsuyuki Matsumoto ,  Koji Nukaga ,  Yasuhiro Kusano ,  Kenji Yokomizo ,  Shingo Watanabe ,  Hiroyuki Ogawara ,  Katsumi Nomura

IPC分类号： C25D3/56 ,  C25D3/12

CPC分类号： C25D3/12 ,  C25D3/562 ,  H05K3/384 ,  H05K3/389 ,  H05K2201/0355 ,  H05K2203/0307 ,  H05K2203/0723 ,  Y10S428/935 ,  Y10T428/12438 ,  Y10T428/12472 ,  Y10T428/12569 ,  Y10T428/12611 ,  Y10T428/12792 ,  Y10T428/1291

摘要： A nickel plating solution preparation method has the steps of: dissolving in water 100 g/L or more and less than 200 g/L of nickel sulfate, and 10 g/L or more and less than 30 g/L of sodium citrate or 8 g/L or more and less than 25 g/L of citric acid, but adding no nickel chloride; and adjusting a pH of the resultant solution to 2 or more and less than 4. Another nickel plating solution preparation method has the steps of: dissolving in water 100 g/L or more and less than 200 g/L of nickel sulfate, and 10 g/L or more and less than 30 g/L of sodium citrate or 8 g/L or more and less than 25 g/L of citric acid, but adding no boric acid; and adjusting a pH of the resultant solution to 2 or more and less than 4.

摘要翻译： 镍镀液制备方法的步骤为：将100g / L以上且小于200g / L的硫酸镍和10g / L以上且小于30g / L的柠檬酸钠或8 g / L以上且小于25g / L的柠檬酸，但不添加氯化镍; 并将所得溶液的pH调节至2以上且小于4.另一种镀镍溶液制备方法具有以下步骤：将100g / L以上且小于200g / L的硫酸镍溶解于水中，将10 g / L以上且小于30g / L的柠檬酸钠或8g / L以上且小于25g / L的柠檬酸，但不添加硼酸; 并将所得溶液的pH调节至2以上且小于4。

公开(公告)号：US07842397B2

公开(公告)日：2010-11-30

申请号：US11524781

申请日：2006-09-21

申请人： Yasuyuki Ito ,  Katsuyuki Matsumoto ,  Koji Nukaga ,  Yasuhiro Kusano ,  Kenji Yokomizo ,  Shingo Watanabe ,  Hiroyuki Ogawara ,  Katsumi Nomura

发明人： Yasuyuki Ito ,  Katsuyuki Matsumoto ,  Koji Nukaga ,  Yasuhiro Kusano ,  Kenji Yokomizo ,  Shingo Watanabe ,  Hiroyuki Ogawara ,  Katsumi Nomura

IPC分类号： B32B15/20 ,  H05K1/03 ,  C25D3/12 ,  C25D7/06

CPC分类号： C25D3/12 ,  C25D3/562 ,  H05K3/384 ,  H05K3/389 ,  H05K2201/0355 ,  H05K2203/0307 ,  H05K2203/0723 ,  Y10S428/935 ,  Y10T428/12438 ,  Y10T428/12472 ,  Y10T428/12569 ,  Y10T428/12611 ,  Y10T428/12792 ,  Y10T428/1291

摘要： A nickel plating solution preparation method has the steps of: dissolving in water 100 g/L or more and less than 200 g/L of nickel sulfate, and 10 g/L or more and less than 30 g/L of sodium citrate or 8 g/L or more and less than 25 g/L of citric acid, but adding no nickel chloride; and adjusting a pH of the resultant solution to 2 or more and less than 4. Another nickel plating solution preparation method has the steps of: dissolving in water 100 g/L or more and less than 200 g/L of nickel sulfate, and 10 g/L or more and less than 30 g/L of sodium citrate or 8 g/L or more and less than 25 g/L of citric acid, but adding no boric acid; and adjusting a pH of the resultant solution to 2 or more and less than 4.

摘要翻译： 镍镀液制备方法的步骤为：将100g / L以上且小于200g / L的硫酸镍和10g / L以上且小于30g / L的柠檬酸钠或8 g / L以上且小于25g / L的柠檬酸，但不添加氯化镍; 并将所得溶液的pH调节至2以上且小于4.另一种镀镍溶液制备方法具有以下步骤：将100g / L以上且小于200g / L的硫酸镍溶解于水中，将10 g / L以上且小于30g / L的柠檬酸钠或8g / L以上且小于25g / L的柠檬酸，但不添加硼酸; 并将所得溶液的pH调节至2以上且小于4。

公开(公告)号：US07108923B1

公开(公告)日：2006-09-19

申请号：US11247297

申请日：2005-10-12

申请人： Yasuyuki Ito ,  Katsuyuki Matsumoto ,  Kenji Yokomizo ,  Yasuhiro Kusano ,  Shinichiro Shimizu ,  Muneo Kodaira ,  Katsumi Nomura

发明人： Yasuyuki Ito ,  Katsuyuki Matsumoto ,  Kenji Yokomizo ,  Yasuhiro Kusano ,  Shinichiro Shimizu ,  Muneo Kodaira ,  Katsumi Nomura

IPC分类号： B32B15/00 ,  B32B15/04 ,  B32B15/20

CPC分类号： C25D5/48 ,  C22C19/03 ,  C23C22/83 ,  C23C28/00 ,  C23C28/321 ,  C23C28/322 ,  C23C28/3225 ,  C23C28/345 ,  C23C2222/10 ,  C25D5/10 ,  C25D5/16 ,  H05K3/384 ,  H05K3/389 ,  H05K2201/0355 ,  H05K2203/0307 ,  H05K2203/0723 ,  Y10T428/12438 ,  Y10T428/12792 ,  Y10T428/12847 ,  Y10T428/12903 ,  Y10T428/1291 ,  Y10T428/273 ,  Y10T428/31663

摘要： A copper foil for a printed circuit board has a rust preventing layer formed by a trivalent chromium chemical conversion treatment on a surface of the copper foil that the copper foil is bonded to a base material for the printed circuit board. T copper foil is of copper or copper alloy, and the rust preventing layer contains 0.5 to 2.5 μg/cm2 of chromium converted into metallic chromium.

摘要翻译： 用于印刷电路板的铜箔具有在铜箔的表面上通过三价铬化学转化处理形成的防锈层，铜箔与印刷电路板的基材接合。 T铜箔为铜或铜合金，防锈层含有转化为金属铬的铬的0.5〜2.5马克/平方厘米。

公开(公告)号：US20100291402A1

公开(公告)日：2010-11-18

申请号：US12846865

申请日：2010-07-30

申请人： Takemi Muroga ,  Yasuyuki Ito ,  Koji Aoyagi ,  Yoshiki Yamamoto ,  Kenji Yokomizo ,  Katsumi Nomura

发明人： Takemi Muroga ,  Yasuyuki Ito ,  Koji Aoyagi ,  Yoshiki Yamamoto ,  Kenji Yokomizo ,  Katsumi Nomura

IPC分类号： B32B15/20

CPC分类号： H05K1/09 ,  C22C9/02 ,  C22F1/08 ,  H05K1/0393 ,  H05K2201/0355 ,  H05K2203/0143 ,  H05K2203/1105 ,  Y10T428/12431

摘要： A rolled copper foil applied with a recrystallization annealing after a final cold rolling step and having a crystal grain alignment satisfying a ratio of [a]/[b]≧3, where [a] and [b] are normalized average intensities of a {111}Cu plane diffraction of a copper crystal by β-scanning at α=35° and 74°, respectively, in an X-ray diffraction pole figure measurement to a rolled surface is manufactured by controlling a total working ratio in the final cold rolling step before the recrystallization annealing to be 94% or more; and controlling a working ratio per one pass in the final cold rolling step to be 15 to 50%.

摘要翻译： 在最终冷轧步骤之后进行再结晶退火并且具有满足[a] / [b]≥3的比例的晶粒取向的轧制铜箔，其中[a]和[b]是{ 111}在X射线衍射极数测量中，通过在最终冷中控制总的工作比来制造在α= 35°和74°的铜晶体的Cu平面衍射 再结晶退火前的轧制步骤为94％以上; 并且在最终冷轧步骤中将每一道次的加工率控制为15〜50％。

公开(公告)号：US20080099110A1

公开(公告)日：2008-05-01

申请号：US11682943

申请日：2007-03-07

申请人： Takemi Muroga ,  Yasuyuki Ito ,  Koji Aoyagi ,  Yoshiki Yamamoto ,  Kenji Yokomizo ,  Katsumi Nomura

发明人： Takemi Muroga ,  Yasuyuki Ito ,  Koji Aoyagi ,  Yoshiki Yamamoto ,  Kenji Yokomizo ,  Katsumi Nomura

IPC分类号： C22F1/08 ,  C22C9/02

CPC分类号： H05K1/09 ,  C22C9/02 ,  C22F1/08 ,  H05K1/0393 ,  H05K2201/0355 ,  H05K2203/0143 ,  H05K2203/1105 ,  Y10T428/12431

摘要： A rolled copper foil applied with a recrystallization annealing after a final cold rolling step and having a crystal grain alignment satisfying a ratio of [a]/[b]≧3, where [a] and [b] are normalized average intensities of a {111}Cu plane diffraction of a copper crystal by β-scanning at α=35° and 74°, respectively, in an X-ray diffraction pole figure measurement to a rolled surface is manufactured by controlling a total working ratio in the final cold rolling step before the recrystallization annealing to be 94% or more; and controlling a working ratio per one pass in the final cold rolling step to be 15 to 50%.

摘要翻译： 在最终冷轧步骤之后进行再结晶退火并且具有满足[a] / [b]> = 3的比例的晶粒取向的轧制铜箔，其中[a]和[b]是a的平均强度 通过在对于轧制表面的X射线衍射极数测量中分别在α= 35°和74°下的β扫描的铜晶体的{111} Cu / 再结晶退火前的最终冷轧工序中的总加工率为94％以上; 并且在最终冷轧步骤中将每一道次的加工率控制为15〜50％。

公开(公告)号：US07789977B2

公开(公告)日：2010-09-07

申请号：US11682943

申请日：2007-03-07

申请人： Takemi Muroga ,  Yasuyuki Ito ,  Koji Aoyagi ,  Yoshiki Yamamoto ,  Kenji Yokomizo ,  Katsumi Nomura

发明人： Takemi Muroga ,  Yasuyuki Ito ,  Koji Aoyagi ,  Yoshiki Yamamoto ,  Kenji Yokomizo ,  Katsumi Nomura

IPC分类号： C22C9/00 ,  C22F1/08

CPC分类号： H05K1/09 ,  C22C9/02 ,  C22F1/08 ,  H05K1/0393 ,  H05K2201/0355 ,  H05K2203/0143 ,  H05K2203/1105 ,  Y10T428/12431

摘要： A rolled copper foil applied with a recrystallization annealing after a final cold rolling step and having a crystal grain alignment satisfying a ratio of [a]/[b]≧3, where [a] and [b] are normalized average intensities of a {111}Cu plane diffraction of a copper crystal by β-scanning at α=35° and 74°, respectively, in an X-ray diffraction pole figure measurement to a rolled surface is manufactured by controlling a total working ratio in the final cold rolling step before the recrystallization annealing to be 94% or more; and controlling a working ratio per one pass in the final cold rolling step to be 15 to 50%.

摘要翻译： 在最终冷轧步骤之后进行再结晶退火并且具有满足[a] / [b]≥3的比例的晶粒取向的轧制铜箔，其中[a]和[b]是{ 111}在X射线衍射极数测量中，通过在最终冷中控制总的工作比来制造在α= 35°和74°的铜晶体的Cu平面衍射 再结晶退火前的轧制步骤为94％以上; 并且在最终冷轧步骤中将每一道次的加工率控制为15〜50％。

公开(公告)号：US07344785B2

公开(公告)日：2008-03-18

申请号：US11249452

申请日：2005-10-14

申请人： Muneo Kodaira ,  Shingo Watanabe ,  Gen Sasaki ,  Yasuyuki Ito ,  Katsumi Nomura

发明人： Muneo Kodaira ,  Shingo Watanabe ,  Gen Sasaki ,  Yasuyuki Ito ,  Katsumi Nomura

IPC分类号： B32B15/20

CPC分类号： C25D5/12 ,  C23C22/53 ,  C23C28/00 ,  C23C28/321 ,  C23C28/322 ,  C23C28/3225 ,  C23C28/345 ,  C23C2222/10 ,  C23C2222/20 ,  C25D5/48 ,  H05K3/384 ,  H05K3/389 ,  H05K2201/0355 ,  H05K2203/0307 ,  H05K2203/0723 ,  Y10T428/12451 ,  Y10T428/12493 ,  Y10T428/12569 ,  Y10T428/12785 ,  Y10T428/12792 ,  Y10T428/1291 ,  Y10T428/24917

摘要： A copper foil 1 comprises a roughened plating layer 2, a Ni—Co alloy plating layer 3, a zinc galvanized (underlying) layer 4, a chromate treatment layer 5, and a silane coupling treatment layer 6 on a surface to be bonded with a base material for a printed circuit board, and the chromate treatment layer 5 is formed by using a trivalent chromium conversion treatment solution containing 70 mg/L or more and less than 500 mg/L of trivalent chromium ions converted into metal chromium and having a pH-value of 3.0 to 4.5. According to the present invention, a copper foil for a printed circuit board, a method for fabricating the same, and a trivalent chromium conversion treatment solution used for fabricating the same, which have an excellent controllability in Zn film forming amount and chromate film forming amount can be obtained.

摘要翻译： 铜箔1包括在与...接合的表面上的粗糙化电镀层2，Ni-Co合金镀层3，镀锌（下层）层4，铬酸盐处理层5和硅烷偶联处理层6 用于印刷电路板的基材，铬酸盐处理层5通过使用含有70mg / L以上且小于500mg / L的三价铬离子转化为金属铬并具有pH值的三价铬转化处理溶液形成 值为3.0〜4.5。 根据本发明，用于印刷电路板的铜箔，其制造方法和用于制造它的三价铬转化处理溶液在Zn膜形成量和铬酸盐膜形成量方面具有优异的控制性 可以获得。

公开(公告)号：US20060257680A1

公开(公告)日：2006-11-16

申请号：US11249452

申请日：2005-10-14

申请人： Muneo Kodaira ,  Shingo Watanabe ,  Gen Sasaki ,  Yasuyuki Ito ,  Katsumi Nomura

发明人： Muneo Kodaira ,  Shingo Watanabe ,  Gen Sasaki ,  Yasuyuki Ito ,  Katsumi Nomura

IPC分类号： C25D5/10 ,  B32B15/00

CPC分类号： C25D5/12 ,  C23C22/53 ,  C23C28/00 ,  C23C28/321 ,  C23C28/322 ,  C23C28/3225 ,  C23C28/345 ,  C23C2222/10 ,  C23C2222/20 ,  C25D5/48 ,  H05K3/384 ,  H05K3/389 ,  H05K2201/0355 ,  H05K2203/0307 ,  H05K2203/0723 ,  Y10T428/12451 ,  Y10T428/12493 ,  Y10T428/12569 ,  Y10T428/12785 ,  Y10T428/12792 ,  Y10T428/1291 ,  Y10T428/24917

摘要： A copper foil 1 comprises a roughened plating layer 2, a Ni—Co alloy plating layer 3, a zinc galvanized (underlying) layer 4, a chromate treatment layer 5, and a silane coupling treatment layer 6 on a surface to be bonded with a base material for a printed circuit board, and the chromate treatment layer 5 is formed by using a trivalent chromium conversion treatment solution containing 70 mg/L or more and less than 500 mg/L of trivalent chromium ions converted into metal chromium and having a pH-value of 3.0 to 4.5. According to the present invention, a copper foil for a printed circuit board, a method for fabricating the same, and a trivalent chromium conversion treatment solution used for fabricating the same, which have an excellent controllability in Zn film forming amount and chromate film forming amount can be obtained.

摘要翻译： 铜箔1包括在与...接合的表面上的粗糙化电镀层2，Ni-Co合金镀层3，镀锌（下层）层4，铬酸盐处理层5和硅烷偶联处理层6 用于印刷电路板的基材，铬酸盐处理层5通过使用含有70mg / L以上且小于500mg / L的三价铬离子转化为金属铬并具有pH值的三价铬转化处理溶液形成 值为3.0〜4.5。 根据本发明，用于印刷电路板的铜箔，其制造方法和用于制造它的三价铬转化处理溶液在Zn膜形成量和铬酸盐膜形成量方面具有优异的控制性 可以获得。

公开(公告)号：US08221897B2

公开(公告)日：2012-07-17

申请号：US12168937

申请日：2008-07-08

申请人： Takemi Muroga ,  Yasuyuki Ito ,  Koji Aoyagi ,  Yoshiki Yamamoto ,  Kenji Yokomizo

发明人： Takemi Muroga ,  Yasuyuki Ito ,  Koji Aoyagi ,  Yoshiki Yamamoto ,  Kenji Yokomizo

IPC分类号： B21C37/00 ,  C22C9/00 ,  C25D7/04

CPC分类号： H05K1/09 ,  B21B1/40 ,  B21B38/00 ,  B21B38/02 ,  B21B2003/005 ,  H05K1/0393 ,  H05K2201/0355 ,  Y10T428/12431

摘要： A rolled copper foil according to the present invention includes a crystal grain alignment wherein: when normalized intensity of {200}Cu plane diffraction of a copper crystal in results obtained by an X-ray diffraction pole figure measurement with respect to a rolled surface is plotted against at different values of angle α, the normalized intensity being obtained during a β scanning in the pole figure measurement, a ratio of a maximum value A of the normalized intensity with angle α in a range of 40° to 60° to a maximum value B of the normalized intensity with angle α in a range of 80° to 90° is equal to or greater than 4; and when the normalized intensity increases with increasing angle α in a range of 25° to 45°, there is essentially no area in which the normalized intensity increases stepwise.

摘要翻译： 根据本发明的轧制铜箔包括晶粒取向，其中：绘制通过相对于轧制表面的X射线衍射极数测量获得的结果中铜晶体的{200} Cu平面衍射的归一化强度被绘制 在角度α的不同值下，归一化强度在a＆bgr期间获得; 在极坐标测量中扫描，归一化强度的最大值A与40度至60度之间的角度α的比值与80度至90度范围内的角度α的归一化强度的最大值B的比率 °等于或大于4; 并且当归一化强度随着角度α在25°至45°的范围内增加时，基本上没有标准化强度逐步增加的区域。

公开(公告)号：US20090017325A1

公开(公告)日：2009-01-15

申请号：US12168937

申请日：2008-07-08

申请人： Takemi Muroga ,  Yasuyuki Ito ,  Koji Aoyagi ,  Yoshiki Yamamoto ,  Kenji Yokomizo

发明人： Takemi Muroga ,  Yasuyuki Ito ,  Koji Aoyagi ,  Yoshiki Yamamoto ,  Kenji Yokomizo

IPC分类号： B32B15/20

CPC分类号： H05K1/09 ,  B21B1/40 ,  B21B38/00 ,  B21B38/02 ,  B21B2003/005 ,  H05K1/0393 ,  H05K2201/0355 ,  Y10T428/12431

摘要： A rolled copper foil according to the present invention includes a crystal grain alignment wherein: when normalized intensity of {200}Cu plane diffraction of a copper crystal in results obtained by an X-ray diffraction pole figure measurement with respect to a rolled surface is plotted against at different values of angle α, the normalized intensity being obtained during a β scanning in the pole figure measurement, a ratio of a maximum value A of the normalized intensity with angle α in a range of 40° to 60° to a maximum value B of the normalized intensity with angle α in a range of 80° to 90° is equal to or greater than 4; and when the normalized intensity increases with increasing angle α in a range of 25° to 45°, there is essentially no area in which the normalized intensity increases stepwise.

摘要翻译： 根据本发明的轧制铜箔包括晶粒取向，其中：绘制通过相对于轧制表面的X射线衍射极数测量获得的结果中铜晶体的{200} Cu平面衍射的归一化强度被绘制 在角度α的不同值下，在极坐标测量中的β扫描期间获得的归一化强度，归一化强度的最大值A与40度至60度范围内的角度α的比值与最大值 角度α在80°至90°的范围内的归一化强度的B等于或大于4; 并且当归一化强度随着角度α在25°至45°的范围内增加而增加时，基本上没有标准化强度逐步增加的区域。