发明授权
- 专利标题: Semiconductor device and method for fabricating the same
- 专利标题(中): 半导体装置及其制造方法
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申请号: US12141530申请日: 2008-06-18
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公开(公告)号: US07843013B2公开(公告)日: 2010-11-30
- 发明人: Ryo Nakagawa , Takayuki Yamada
- 申请人: Ryo Nakagawa , Takayuki Yamada
- 申请人地址: JP Osaka
- 专利权人: Panasonic Corporation
- 当前专利权人: Panasonic Corporation
- 当前专利权人地址: JP Osaka
- 代理机构: McDermott Will & Emery LLP
- 优先权: JP2007-196287 20070727
- 主分类号: H01L29/76
- IPC分类号: H01L29/76 ; H01L29/00
摘要:
A semiconductor device includes: an isolation region formed in a semiconductor substrate; active regions surrounded by the isolation region and including p-type and n-type regions, respectively; an NMOS transistor formed in the active region including the p-type region and including an n-type gate electrode; a PMOS transistor formed in the active region including the n-type region and including a p-type gate electrode; and a p-type resistor formed on the isolation region. The p-type resistor has an internal stress greater than that of the p-type gate electrode.
公开/授权文献
- US20090026551A1 SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME 公开/授权日:2009-01-29
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