Invention Grant
US07863758B2 Adhesive film composition, associated dicing die bonding film, and die package
有权
粘合膜组成，相关切割模片接合薄膜和模具包装
- Patent Title: Adhesive film composition, associated dicing die bonding film, and die package
- Patent Title (中): 粘合膜组成，相关切割模片接合薄膜和模具包装
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Application No.: US12000070Application Date: 2007-12-07
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Publication No.: US07863758B2Publication Date: 2011-01-04
- Inventor: Ki Sung Jung , Wan Jung Kim , Yong Woo Hong , Chang Bum Chung , Chul Jeong , Ah Ram Pyun , Su Mi Im , Kyoung Jin Ha
- Applicant: Ki Sung Jung , Wan Jung Kim , Yong Woo Hong , Chang Bum Chung , Chul Jeong , Ah Ram Pyun , Su Mi Im , Kyoung Jin Ha
- Applicant Address: KR Gumi-si, Kyeongsangbuk-do
- Assignee: Cheil Industries, Inc.
- Current Assignee: Cheil Industries, Inc.
- Current Assignee Address: KR Gumi-si, Kyeongsangbuk-do
- Agency: Lee & Morse, P.C.
- Priority: KR10-2006-0127293 20061213
- Main IPC: H01L23/488
- IPC: H01L23/488 ; B32B27/36 ; B32B27/38 ; C08L63/00 ; C08L67/02
Abstract:
An adhesive film composition includes a polyester-based thermoplastic resin, an elastomer resin containing at least one of a hydroxyl group, a carboxyl group, or an epoxy group, an epoxy resin, a phenol curing agent, one or more of a latent catalytic curing agent or a curing catalyst, a silane coupling agent, and a filler.
Public/Granted literature
- US20080145668A1 Adhesive film composition, associated dicing die bonding film, and die package Public/Granted day:2008-06-19
Information query
IPC分类:
