Invention Grant
US07868465B2 Semiconductor device with a metallic carrier and two semiconductor chips applied to the carrier
有权
具有金属载体的半导体器件和应用于载体的两个半导体芯片
- Patent Title: Semiconductor device with a metallic carrier and two semiconductor chips applied to the carrier
- Patent Title (中): 具有金属载体的半导体器件和应用于载体的两个半导体芯片
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Application No.: US11757649Application Date: 2007-06-04
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Publication No.: US07868465B2Publication Date: 2011-01-11
- Inventor: Ralf Otremba , Joachim Mahler , Bernd Rakow , Reimund Engl , Rupert Fischer
- Applicant: Ralf Otremba , Joachim Mahler , Bernd Rakow , Reimund Engl , Rupert Fischer
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Dicke, Billig & Czaja, PLLC
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L21/58
Abstract:
A semiconductor device is disclosed. One embodiment provides a device including a carrier, an electrically insulating layer applied onto the carrier, an adhesive layer applied to the electrically insulating layer. A first semiconductor chip applied to the adhesive layer.
Public/Granted literature
- US20080296782A1 SEMICONDUCTOR DEVICE Public/Granted day:2008-12-04
Information query
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