发明授权
- 专利标题： Substrate processing apparatus and lid supporting apparatus for the substrate processing apparatus
- 专利标题（中）： 用于基板处理装置的基板处理装置和盖支撑装置
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申请号： US11506773申请日： 2006-08-21
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公开(公告)号： US07883579B2公开(公告)日： 2011-02-08
- 发明人: Akira Kodashima , Shinichi Miyano , Takehiro Kato
- 申请人： Akira Kodashima , Shinichi Miyano , Takehiro Kato
- 申请人地址： JP Tokyo
- 专利权人： Tokyo Electron Limited
- 当前专利权人： Tokyo Electron Limited
- 当前专利权人地址： JP Tokyo
- 代理机构： Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- 优先权： JP2005-360934 20051214
- 主分类号： C23C16/00
- IPC分类号： C23C16/00 ; C23F1/00 ; H01L21/306
摘要：
A substrate processing apparatus which enables the work efficiency of maintenance to be improved. The substrate processing apparatus comprises a plurality of processing chambers 100 for carrying out plasma processing on a wafer to be processed. Each processing chamber 100 has a chamber lid 200 that can be suspended and supported by a crane unit 500. The crane unit 500 comprises an air cylinder 510 and a linear guide 520. The air cylinder 510 holds the chamber lid 200 movably in a vertical direction thereabove. The linear guide 520 holds the chamber lid 200 movably in a horizontal direction.
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