发明授权
- 专利标题： Wiring and method of manufacturing the same, and wiring board and method of manufacturing the same
- 专利标题（中）： 接线及其制造方法以及接线板及其制造方法
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申请号： US11525016申请日： 2006-09-22
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公开(公告)号： US07884369B2公开(公告)日： 2011-02-08
- 发明人: Shunpei Yamazaki , Hideomi Suzawa , Koji Ono , Yoshihiro Kusuyama
- 申请人： Shunpei Yamazaki , Hideomi Suzawa , Koji Ono , Yoshihiro Kusuyama
- 申请人地址： JP Atsugi-shi, Kanagawa-ken
- 专利权人： Semiconductor Energy Laboratory Co., Ltd.
- 当前专利权人： Semiconductor Energy Laboratory Co., Ltd.
- 当前专利权人地址： JP Atsugi-shi, Kanagawa-ken
- 代理机构： Robinson Intellectual Property Law Office, P.C.
- 代理商 Eric J. Robinson
- 优先权： JP2001-091192 20010327
- 主分类号： H01L27/14
- IPC分类号： H01L27/14 ; H01L29/04 ; H01L29/15 ; H01L31/036
摘要：
The wiring of the present invention has a layered structure that includes a first conductive layer (first layer) having a first width and made of one or a plurality of kinds of elements selected from W and Mo, or an alloy or compound mainly containing the element, a low-resistant second conductive layer (second layer) having a second width smaller than the first width, and made of an alloy or a compound mainly containing Al, and a third conductive layer (third layer) having a third width smaller than the second width, and made of an alloy or compound mainly containing Ti. With this constitution, the present invention is fully ready for enlargement of a pixel portion. At least edges of the second conductive layer have a taper-shaped cross-section. Because of this shape, satisfactory coverage can be obtained.
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