Invention Grant
US07885718B2 Component mounting apparatus, service providing device and servicing method
有权
组件安装装置，服务提供装置和维修方法
- Patent Title: Component mounting apparatus, service providing device and servicing method
- Patent Title (中): 组件安装装置，服务提供装置和维修方法
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Application No.: US12421272Application Date: 2009-04-09
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Publication No.: US07885718B2Publication Date: 2011-02-08
- Inventor: Toshio Yano , Hiroshi Okamura , Yoshihiko Misawa , Yoshinori Isobata , Ken Takahashi , Masuo Masui , Eigo Sarashina , Akira Iizuka
- Applicant: Toshio Yano , Hiroshi Okamura , Yoshihiko Misawa , Yoshinori Isobata , Ken Takahashi , Masuo Masui , Eigo Sarashina , Akira Iizuka
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: Greenblum & Bernstein P.L.C.
- Priority: JP2001-002066 20010110; JP2001-092484 20010328
- Main IPC: G06F19/00
- IPC: G06F19/00 ; G05B19/18
Abstract:
A service receiving method for receiving a component library generated from mounted component data, including component size and mounting conditions, via a communication system that includes the Internet. The method includes the service provider receiving mounted component data having mounting conditions actually realized by a fabrication of non-defective products. The method also includes the service provider deriving a component library from a mounted component database.
Public/Granted literature
- US20090259333A1 COMPONENT MOUNTING APPARATUS, SERVICE PROVIDING DEVICE AND SERVICING METHOD Public/Granted day:2009-10-15
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