Sheet thickness detecting device, feeding device, and image forming apparatus
    3.
    发明授权
    Sheet thickness detecting device, feeding device, and image forming apparatus 有权
    板厚检测装置,送料装置和成像装置

    公开(公告)号:US08794626B2

    公开(公告)日:2014-08-05

    申请号:US13756684

    申请日:2013-02-01

    IPC分类号: B65H7/12 B65H7/02

    摘要: A sheet thickness detecting device for detecting a thickness of a sheet includes a fixed roller rotatably supported by a shaft so that the fixed roller faces the sheet; a movable roller rotatably provided so that the movable roller and the fixed roller sandwich and feed the sheet, and configured to be displaced in accordance with the thickness of the sandwiched sheet; a swing member rotatably supporting the movable roller and including a shaft so that the swing member is swung around the shaft, wherein the swing member further includes a detection target part formed in a manner that a distance between the detection target part and the shaft is greater than that between a position where the movable roller is supported by the swing member and the shaft; and a detecting unit detecting the displacement amount of the detection target part of the swing member.

    摘要翻译: 用于检测片材厚度的片材厚度检测装置包括由轴可旋转地支撑的固定辊,使得固定的辊面对片材; 可移动的辊,其可旋转地设置成使得所述可动辊和所述固定辊夹持并进给所述片材,并且被构造成根据所述夹层片材的厚度移位; 摆动构件,其可旋转地支撑所述可动辊并且包括轴,使得所述摆动构件围绕所述轴摆动,其中所述摆动构件还包括以使得所述检测对象部分和所述轴之间的距离更大的方式形成的检测目标部分 比可动辊被摆动构件支撑的位置与轴之间的位移大; 以及检测单元,检测摆动构件的检测目标部分的位移量。

    Manufacturing method for semiconductor device having a multilayer interconnect
    10.
    发明授权
    Manufacturing method for semiconductor device having a multilayer interconnect 失效
    具有多层互连的半导体器件的制造方法

    公开(公告)号:US06350674B1

    公开(公告)日:2002-02-26

    申请号:US09534937

    申请日:2000-03-24

    申请人: Hiroshi Okamura

    发明人: Hiroshi Okamura

    IPC分类号: H01L214763

    摘要: A semiconductor device having good electrical properties, and a method of manufacturing this semiconductor device by forming an insulation layer on a first wiring layer and then, simultaneously forming in this insulation layer a second wiring layer and a contact layer for connecting the first wiring layer and the second wiring layer. A positive resist layer having an opening over an area where a through-hole is to be formed is first formed on the insulation layer. A negative resist layer having an opening over an area where a wiring trench is to be formed is then formed on the positive resist layer. The insulation layer, positive resist layer, and negative resist layer are then simultaneously etched to form a wiring trench and through-hole that are automatically aligned with each other. The wiring trench and through-hole are then filled with a conductive material to form a second wiring layer and contact layer.

    摘要翻译: 一种具有良好电性能的半导体器件,以及通过在第一布线层上形成绝缘层然后在该绝缘层上同时形成第二布线层和用于连接第一布线层和 第二布线层。 首先在绝缘层上形成具有在要形成通孔的区域上的开口的正性抗蚀剂层。 然后在正抗蚀剂层上形成具有在要形成布线沟槽的区域上的开口的负的抗蚀剂层。 然后同时蚀刻绝缘层,正性抗蚀剂层和负性抗蚀剂层,以形成彼此自动对准的布线沟槽和通孔。 然后用导电材料填充布线沟槽和通孔,以形成第二布线层和接触层。