发明授权
- 专利标题： Microelectromechanical systems encapsulation process
- 专利标题（中）： 微机电系统封装工艺
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申请号： US12506219申请日： 2009-07-20
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公开(公告)号： US07898046B2公开(公告)日： 2011-03-01
- 发明人: Markus Ulm , Brian Stark , Matthias Metz , Tino Fuchs , Franz Laermer , Silvia Kronmueller
- 申请人： Markus Ulm , Brian Stark , Matthias Metz , Tino Fuchs , Franz Laermer , Silvia Kronmueller
- 申请人地址： DE Stuttgart
- 专利权人： Robert Bosch GmbH
- 当前专利权人： Robert Bosch GmbH
- 当前专利权人地址： DE Stuttgart
- 代理机构： Dergosits & Noah LLP
- 代理商 Geoffrey T. Staniford
- 主分类号： H01L21/00
- IPC分类号： H01L21/00
摘要：
An encapsulated MEMS process including a high-temperature anti-stiction coating that is stable under processing steps at temperatures over 450 C is described. The coating is applied after device release but before sealing vents in the encapsulation layer. Alternatively, an anti-stiction coating may be applied to released devices directly before encapsulation.
公开/授权文献
- US20090278214A1 Microelectromechanical Systems Encapsulation Process 公开/授权日：2009-11-12
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