Invention Grant
US07900808B2 Soldering method and system thereof 有权
焊接方法及其系统

Soldering method and system thereof
Abstract:
A soldering system includes a circuit board having first soldering terminals, a soldering object having second soldering terminals, soldering blocks disposed between the circuit board and the soldering object for electrically interconnecting the first soldering terminals and the second soldering terminals respectively, and a supporting structure supporting the soldering object and having a height that determines the height of the solder blocks. A related soldering method is also provided.
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