Invention Grant
- Patent Title: Soldering method and system thereof
- Patent Title (中): 焊接方法及其系统
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Application No.: US12384361Application Date: 2009-04-03
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Publication No.: US07900808B2Publication Date: 2011-03-08
- Inventor: Po-Shan Huang , Jia-Shyong Cheng
- Applicant: Po-Shan Huang , Jia-Shyong Cheng
- Applicant Address: TW Miao-Li County
- Assignee: Chimei Innolux Corporation
- Current Assignee: Chimei Innolux Corporation
- Current Assignee Address: TW Miao-Li County
- Agent Wei Te Chung
- Priority: TW97112276A 20080403
- Main IPC: B23K1/00
- IPC: B23K1/00 ; B23K101/42

Abstract:
A soldering system includes a circuit board having first soldering terminals, a soldering object having second soldering terminals, soldering blocks disposed between the circuit board and the soldering object for electrically interconnecting the first soldering terminals and the second soldering terminals respectively, and a supporting structure supporting the soldering object and having a height that determines the height of the solder blocks. A related soldering method is also provided.
Public/Granted literature
- US20090250507A1 Soldering method and system thereof Public/Granted day:2009-10-08
Information query
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