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公开(公告)号：US08822829B2
公开(公告)日：2014-09-02
申请号：US13339696
申请日：2011-12-29
Applicant: Jia-Shyong Cheng , Po-Shan Huang , Po-Sheng Shih , Chun-Yi Hu , Chih-Han Chao , Jeah-Sheng Wu
Inventor： Jia-Shyong Cheng , Po-Shan Huang , Po-Sheng Shih , Chun-Yi Hu , Chih-Han Chao , Jeah-Sheng Wu
CPC classification number: B82Y30/00 , H05K1/0287 , H05K1/097 , H05K3/386 , H05K2201/0108 , H05K2201/026 , H05K2201/0323
Abstract: A patterned conductive element includes a substrate having a surface, an adhesive layer located on the surface, and a patterned carbon nanotube layer located on the adhesive layer. Part of the patterned carbon nanotube layer is embedded in the adhesive layer, and the other part of the patterned carbon nanotube layer is exposed from the adhesive layer.
Abstract translation: 图案化导电元件包括具有表面的基板，位于表面上的粘合剂层和位于粘合剂层上的图案化碳纳米管层。 图案化碳纳米管层的一部分嵌入粘合剂层中，并且图案化的碳纳米管层的另一部分从粘合剂层露出。
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2.发明申请公开(公告)号：US20100097772A1
公开(公告)日：2010-04-22
申请号：US12589230
申请日：2009-10-19
Applicant: Po-Shan Huang , Jia-Shyong Cheng
Inventor： Po-Shan Huang , Jia-Shyong Cheng
IPC: H05K1/11
CPC classification number: H05K3/363 , H05K2201/09427 , H05K2201/09727 , H05K2201/10128
Abstract: A display device includes a circuit board connecting structure. The circuit board connecting structure includes a first circuit board, a soldering layer, and a second circuit board. The first circuit board includes a baseboard and a plurality of parallel elongate first electrodes defined at a predetermined area. The second circuit board includes a plurality of parallel elongate second electrodes positioned at the predetermined area. The second electrodes are electrically connected to the corresponding first electrodes via the soldering layer. A space defined by the projection of the second electrodes to the baseboard of the first circuit board is filled in by the soldering layer.
Abstract translation: 显示装置包括电路板连接结构。 电路板连接结构包括第一电路板，焊接层和第二电路板。 第一电路板包括基板和限定在预定区域的多个平行细长的第一电极。 第二电路板包括位于预定区域的多个平行细长的第二电极。 第二电极通过焊接层电连接到对应的第一电极。 通过焊接层填充由第二电极向第一电路板的基板的突起限定的空间。
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公开(公告)号：US07900808B2
公开(公告)日：2011-03-08
申请号：US12384361
申请日：2009-04-03
Applicant: Po-Shan Huang , Jia-Shyong Cheng
Inventor： Po-Shan Huang , Jia-Shyong Cheng
IPC: B23K1/00 , B23K101/42
CPC classification number: B23K1/0016 , H05K3/363 , H05K2201/2036
Abstract: A soldering system includes a circuit board having first soldering terminals, a soldering object having second soldering terminals, soldering blocks disposed between the circuit board and the soldering object for electrically interconnecting the first soldering terminals and the second soldering terminals respectively, and a supporting structure supporting the soldering object and having a height that determines the height of the solder blocks. A related soldering method is also provided.
Abstract translation: 焊接系统包括具有第一焊接端子的电路板，具有第二焊接端子的焊接对象，设置在电路板和焊接对象之间的焊接块，用于分别电连接第一焊接端子和第二焊接端子;以及支撑结构， 焊接对象并且具有确定焊料块的高度的高度。 还提供了相关的焊接方法。
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Patent Agency Ranking
公开(公告)号：US20090250507A1
公开(公告)日：2009-10-08
申请号：US12384361
申请日：2009-04-03
Applicant: Po-Shan Huang , Jia-Shyong Cheng
Inventor： Po-Shan Huang , Jia-Shyong Cheng
CPC classification number: B23K1/0016 , H05K3/363 , H05K2201/2036
Abstract: A soldering system includes a circuit board having first soldering terminals, a soldering object having second soldering terminals, soldering blocks disposed between the circuit board and the soldering object for electrically interconnecting the first soldering terminals and the second soldering terminals respectively, and a supporting structure supporting the soldering object and having a height that determines the height of the solder blocks. A related soldering method is also provided.
Abstract translation: 焊接系统包括具有第一焊接端子的电路板，具有第二焊接端子的焊接对象，设置在电路板和焊接对象之间的焊接块，用于分别电连接第一焊接端子和第二焊接端子;以及支撑结构， 焊接对象并且具有确定焊料块的高度的高度。 还提供了相关的焊接方法。
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公开(公告)号：US08871293B2
公开(公告)日：2014-10-28
申请号：US13339658
申请日：2011-12-29
Applicant: Jia-Shyong Cheng , Po-Shan Huang , Po-Sheng Shih , Chun-Yi Hu , Chih-Han Chao , Jeah-Sheng Wu
Inventor： Jia-Shyong Cheng , Po-Shan Huang , Po-Sheng Shih , Chun-Yi Hu , Chih-Han Chao , Jeah-Sheng Wu
CPC classification number: B05D5/12 , B82Y30/00 , C08F2/48 , C08J7/04 , G06F3/045 , G06F2203/04103 , H01B13/00
Abstract: The present disclosure relates to a method for making touch panel. A substrate having a surface is provided. The substrate defines two areas: a touch-view area and a trace area. An adhesive layer is formed on the surface of the substrate. The adhesive layer on the trace area is solidified. A carbon nanotube layer is formed on the adhesive layer. The adhesive layer on the touch-view area is solidified. The carbon nanotube layer on the trace area is removed. At least one electrode and a conductive trace is formed.
Abstract translation: 本公开涉及一种用于制造触摸面板的方法。 提供具有表面的基板。 基板定义了两个区域：触摸视图区域和迹线区域。 在基板的表面上形成粘接层。 痕量区域上的粘合剂层固化。 在粘合剂层上形成碳纳米管层。 触感区域上的粘合剂层被固化。 去除痕量区域上的碳纳米管层。 形成至少一个电极和导电迹线。
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公开(公告)号：US08623224B2
公开(公告)日：2014-01-07
申请号：US13339703
申请日：2011-12-29
Applicant: Jia-Shyong Cheng , Po-Shan Huang , Po-Sheng Shih , Chun-Yi Hu , Chih-Han Chao , Jeah-Sheng Wu
Inventor： Jia-Shyong Cheng , Po-Shan Huang , Po-Sheng Shih , Chun-Yi Hu , Chih-Han Chao , Jeah-Sheng Wu
CPC classification number: B32B37/12 , B32B2305/72 , B32B2309/105 , B32B2310/0831 , B32B2313/04 , B32B2457/206 , B32B2457/208 , B82Y30/00 , H01L51/444 , H05K1/097 , H05K3/048 , H05K3/386 , H05K2201/026 , H05K2203/1476
Abstract: The present disclosure relates to a method for making pattern conductive element. The method includes steps. A substrate having a surface is provide. An adhesive layer is formed on the surface of the substrate. Part of the adhesive layer is solidified to form a solidified adhesive layer and a non-solidified adhesive layer. A carbon nanotube layer is applied on the adhesive layer. The non-solidified adhesive layer is solidified so that the carbon nanotube layer on the non-solidified adhesive layer forms a fixed carbon nanotube layer and the carbon nanotube layer on the solidified adhesive layer forms a non-fixed carbon nanotube layer. The non-fixed carbon nanotube layer is removed and the fixed carbon nanotube layer is remained to form a pattern carbon nanotube layer.
Abstract translation: 本公开涉及一种制造图案导电元件的方法。 该方法包括步骤。 提供具有表面的基板。 在基板的表面上形成粘接层。 粘合剂层的一部分被固化以形成固化的粘合剂层和非固化的粘合剂层。 将碳纳米管层施加在粘合剂层上。 非固化粘合剂层固化，使得非固化粘合剂层上的碳纳米管层形成固定碳纳米管层，并且固化粘合剂层上的碳纳米管层形成非固定碳纳米管层。 去除非固定碳纳米管层，并保留固定碳纳米管层以形成图案碳纳米管层。
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公开(公告)号：US20050284567A1
公开(公告)日：2005-12-29
申请号：US11168610
申请日：2005-06-27
Applicant: Po-Shan Huang
Inventor： Po-Shan Huang
CPC classification number: B29C65/18 , B23K20/023 , B23K2101/38 , B29C65/242 , B29C66/1122 , B29C66/43 , B29C66/80 , B29C66/8322
Abstract: A device (1) for bonding two components (31, 32) includes a heating unit (11) and a lifting device (13) used to drive the heating unit to move. The heating unit includes a pressing device (17) including a pressing plate (171). The pressing plate can conduct heat, and the pressing plate is adapted to press the components. The bonding device can prevent protuberances from forming in a connecting part between the bonding components and can achieve reliable hot pressing result.
Abstract translation: 用于接合两个部件（31,32）的装置（1）包括用于驱动加热单元移动的加热单元（11）和提升装置（13）。 加热单元包括具有加压板（171）的加压装置（17）。 压板可以传导热量，并且压板适于按压部件。 接合装置可以防止在接合部件之间的连接部分中形成突起，并且可以实现可靠的热压结果。
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公开(公告)号：US20060146569A1
公开(公告)日：2006-07-06
申请号：US11317177
申请日：2005-12-23
Applicant: Po-Shan Huang , Shuai Guo , Ya-Dan Liang
Inventor： Po-Shan Huang , Shuai Guo , Ya-Dan Liang
IPC: F21V7/04
CPC classification number: G02B6/0021
Abstract: A backlight module (3) includes a light guide plate (31) having an incident surface (311), and a plurality of light sources (32) disposed opposite to the incident surface. Each of the light sources defines an encapsulation portion (321) to cover and protect core parts of the light source. A filler portion (33) is provided between the light source and the incident surface. A refractive index of the filler portion is the same as refractive indexes of the encapsulation portions and the light guide plate. Therefore a transmission rate of light beams from each light source to the light guide plate approaches or even is 1. Thus the transmission rate of the backlight module is correspondingly high. The arrangement of the filler portion between the light guide plate and the light sources decreases or even eliminates loss of light beams. Therefore the utilization of light beams and the brightness of the backlight module are improved.
Abstract translation: 背光模块（3）包括具有入射表面（311）的导光板（31）和与入射表面相对设置的多个光源（32）。 每个光源限定了用于覆盖和保护光源的核心部分的封装部分（321）。 填充部分（33）设置在光源和入射表面之间。 填充部的折射率与封装部和导光板的折射率相同。 因此，从每个光源到导光板的光束的传输速率接近或甚至为1.因此，背光模块的传输速率相应地高。 导光板和光源之间的填充部分的布置减少或甚至消除光束的损失。 因此，提高了光束的利用和背光模块的亮度。
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