Invention Grant
- Patent Title: Light emitting diode structure having a textured package lens
- Patent Title (中): 具有纹理化封装透镜的发光二极管结构
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Application No.: US12485237Application Date: 2009-06-16
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Publication No.: US07956375B2Publication Date: 2011-06-07
- Inventor: Yueh-Han Li , Po-Tang Hsu , Chien-Ming Ko , Hung-Ching Lee , Chih-Wei Lin
- Applicant: Yueh-Han Li , Po-Tang Hsu , Chien-Ming Ko , Hung-Ching Lee , Chih-Wei Lin
- Applicant Address: TW Hsin-Chu
- Assignee: AU Optronics Corporation
- Current Assignee: AU Optronics Corporation
- Current Assignee Address: TW Hsin-Chu
- Agency: Thomas, Kayden, Horstemeyer & Risley, LLP
- Priority: TW97131841A 20080820
- Main IPC: H01L29/22
- IPC: H01L29/22 ; H01L29/227 ; H01L33/00 ; H01L31/0203
Abstract:
A light emitting diode structure and a light emitting diode structure forming method are provided. The light emitting diode structure includes a base, a diode chip, and a package lens. The diode chip is mounted on the base. The package lens covers the diode chip. The surface of the package lens includes a plurality of dot structures. The steps of the method include mounting a light-emitting diode chip on a base, assembling a package lens to cover the light emitting diodes chip, and forming a plurality of dot structures on the surface of the package lens.
Public/Granted literature
- US20100044732A1 Light Emitting Diode Structure and Method of Forming the Same Public/Granted day:2010-02-25
Information query
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