Invention Grant
- Patent Title: Mechanical decoupling of a probe card assembly to improve thermal response
- Patent Title (中): 探针卡组件的机械去耦以改善热响应
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Application No.: US12478117Application Date: 2009-06-04
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Publication No.: US07960989B2Publication Date: 2011-06-14
- Inventor: Keith J. Breinlinger , Eric D. Hobbs
- Applicant: Keith J. Breinlinger , Eric D. Hobbs
- Applicant Address: US CA Livermore
- Assignee: FormFactor, Inc.
- Current Assignee: FormFactor, Inc.
- Current Assignee Address: US CA Livermore
- Agency: Kirton & McConkie
- Main IPC: G01R31/20
- IPC: G01R31/20 ; G01R31/02

Abstract:
A stiffener structure, a wiring substrate, and a frame having a major surface disposed in a stack can be part of a probe card assembly. The wiring substrate can be disposed between the frame and the stiffener structure, and probe substrates can be coupled to the frame by one or more non-adjustably fixed coupling mechanisms. Each of the probe substrates can have probes that are electrically connected through the probe card assembly to an electrical interface on the wiring substrate to a test controller. The non-adjustably fixed coupling mechanisms can be simultaneously stiff in a first direction perpendicular to the major surface and flexible in a second direction generally parallel to the major surface.
Public/Granted literature
- US20100134127A1 MECHANICAL DECOUPLING OF A PROBE CARD ASSEMBLY TO IMPROVE THERMAL RESPONSE Public/Granted day:2010-06-03
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