公开(公告)号：US09702904B2

公开(公告)日：2017-07-11

申请号：US13288925

申请日：2011-11-03

Applicant: Keith J. Breinlinger ,  Benjamin N. Eldridge ,  Eric D. Hobbs ,  Michael J. Armstrong ,  John K. Gritters

Inventor： Keith J. Breinlinger ,  Benjamin N. Eldridge ,  Eric D. Hobbs ,  Michael J. Armstrong ,  John K. Gritters

IPC: G01R1/067 ,  H01R13/24 ,  G01R1/073 ,  H01R43/16

CPC classification number: G01R1/06716 ,  G01R1/06733 ,  G01R1/07357 ,  H01R13/2407 ,  H01R43/16 ,  Y10T29/49204

Abstract: An electrically conductive contact element can include a first base and a second base with elongate, spaced apart leaves between the bases. A first end of each leaf can be coupled to the first base and an opposite second end of the leaf can be coupled to the second base. A body of the leaf between the first end and the second end can be sufficiently elongate to respond to a force through said contact element substantially parallel with the first axis and the second axis by first compressing axially while said force is less than a buckling force and then bending while said force is greater than the buckling force.

公开(公告)号：US20100134129A1

公开(公告)日：2010-06-03

申请号：US12327643

申请日：2008-12-03

Applicant: Keith J. Breinlinger ,  Eric D. Hobbs

Inventor： Keith J. Breinlinger ,  Eric D. Hobbs

IPC: G01R31/26 ,  G01R1/067 ,  G01R31/02

CPC classification number: G01R31/2874 ,  G01R31/2889

Abstract: A stiffener structure, a wiring substrate, and a frame having a major surface disposed in a stack can be part of a probe card assembly. The wiring substrate can be disposed between the frame and the stiffener structure, and probe substrates can be coupled to the frame by one or more non-adjustably fixed coupling mechanisms. Each of the probe substrates can have probes that are electrically connected through the probe card assembly to an electrical interface on the wiring substrate to a test controller. The non-adjustably fixed coupling mechanisms can be simultaneously stiff in a first direction perpendicular to the major surface and flexible in a second direction generally parallel to the major surface.

公开(公告)号：US20090206860A1

公开(公告)日：2009-08-20

申请号：US12165325

申请日：2008-06-30

Applicant: Andrew W. McFarland ,  Kevin Youl Yasumura ,  Eric D. Hobbs ,  Keith J. Breinlinger

Inventor： Andrew W. McFarland ,  Kevin Youl Yasumura ,  Eric D. Hobbs ,  Keith J. Breinlinger

IPC: G01R1/04

CPC classification number: G01R1/44 ,  G01R1/07307 ,  G01R31/2891

Abstract: A thermal adjustment apparatus for adjusting one or more thermally induced movements of an electro-mechanical assembly includes: a compensating element expanding at a first rate different from a second rate at which the electro-mechanical assembly expands for generating a counteracting force in response to changes in temperature; and a coupling mechanism coupling the compensating element to the electro-mechanical assembly, and being adjustable to control an amount of the counteracting force applied to the electro-mechanical assembly as temperature changes.

Abstract translation: 一种用于调节机电组件的一个或多个热诱导运动的热调节装置包括：补偿元件以不同于机电组件膨胀的第二速率的第一速率膨胀以产生响应于变化的反作用力 温度; 以及将补偿元件耦合到机电组件的耦合机构，并且可调节以在温度变化时控制施加到机电组件的抵抗力的量。

公开(公告)号：US20110156735A1

公开(公告)日：2011-06-30

申请号：US12979200

申请日：2010-12-27

Applicant: Keith J. Breinlinger ,  Eric D. Hobbs

Inventor： Keith J. Breinlinger ,  Eric D. Hobbs

IPC: G01R31/00

CPC classification number: G01R1/0491 ,  G01R31/3025

Abstract: Wafer cassette systems and methods of using wafer cassette systems. A wafer cassette system can include a base and a probe card assembly. The base and the probe card assembly can each include complementary interlocking alignment elements. The alignment elements can constrain relative movement of the base and probe card assembly in directions parallel to a wafer receiving surface of the base, while permitting relative movement in a direction perpendicular to the receiving surface.

Abstract translation: 晶圆盒系统和使用晶片盒系统的方法。 晶片盒系统可以包括基座和探针卡组件。 基座和探针卡组件可以各自包括互补的互锁对准元件。 对准元件可以约束基部和探针卡组件在平行于基部的晶片接收表面的方向上的相对运动，同时允许在垂直于接收表面的方向上的相对运动。

公开(公告)号：US20110156734A1

公开(公告)日：2011-06-30

申请号：US12979159

申请日：2010-12-27

Applicant: Tommie E. Berry ,  Keith J. Breinlinger ,  Eric D. Hobbs ,  Marc Loranger ,  Alexander H. Slocum ,  Adrian S. Wilson

Inventor： Tommie E. Berry ,  Keith J. Breinlinger ,  Eric D. Hobbs ,  Marc Loranger ,  Alexander H. Slocum ,  Adrian S. Wilson

IPC: G01R31/00

CPC classification number: G01R31/2891

Abstract: Devices under test (DUTs) can be tested in a test system that includes an aligner and test cells. A DUT can be moved into and clamped in an aligned position on a carrier in the aligner. In the align position, electrically conductive terminals of the DUT can be in a predetermined position with respect to carrier alignment features of the carrier. The DUT/carrier combination can then be moved from the aligner into one of the test cells, where alignment features of the carrier are mechanically coupled with alignment features of a contactor in the test cell. The mechanical coupling automatically aligns terminals of the DUT with probes of the contactor. The probes thus contact and make electrical connections with the terminals of the DUT. The DUT is then tested. The aligner and each of the test cells can be separate and independent devices so that a DUT can be aligned in the aligner while other DUTs, having previously been aligned to a carrier in the aligner, are tested in a test cell.

Abstract translation: 被测设备（DUT）可以在包括对准器和测试单元的测试系统中进行测试。 DUT可以被移动并被夹持在对准器中的载体上的对准位置。 在对准位置，DUT的导电端子可以相对于载体的载体对准特征处于预定位置。 然后可以将DUT /载体组合从对准器移动到测试单元之一中，其中载体的对准特征与测试单元中的接触器的对准特征机械耦合。 机械联轴器将DUT的端子自动对准接触器的探头。 探头因此与DUT的端子接触并进行电气连接。 然后测试DUT。 对准器和每个测试单元可以是分离和独立的器件，使得DUT可以在对准器中对准，而在测试单元中测试已经与对准器中的载体对准的其它DUT。

公开(公告)号：US07960989B2

公开(公告)日：2011-06-14

申请号：US12478117

申请日：2009-06-04

Applicant: Keith J. Breinlinger ,  Eric D. Hobbs

Inventor： Keith J. Breinlinger ,  Eric D. Hobbs

IPC: G01R31/20 ,  G01R31/02

CPC classification number: G01R31/2889

Abstract: A stiffener structure, a wiring substrate, and a frame having a major surface disposed in a stack can be part of a probe card assembly. The wiring substrate can be disposed between the frame and the stiffener structure, and probe substrates can be coupled to the frame by one or more non-adjustably fixed coupling mechanisms. Each of the probe substrates can have probes that are electrically connected through the probe card assembly to an electrical interface on the wiring substrate to a test controller. The non-adjustably fixed coupling mechanisms can be simultaneously stiff in a first direction perpendicular to the major surface and flexible in a second direction generally parallel to the major surface.

Abstract translation: 加强结构，布线基板和具有设置在堆叠中的主表面的框架可以是探针卡组件的一部分。 布线基板可以设置在框架和加强件结构之间，并且探针基板可以通过一个或多个不可调节地固定的联接机构联接到框架。 每个探针基板可以具有通过探针卡组件电连接到布线基板上的电接口到测试控制器的探针。 不可调节固定的联接机构可以在垂直于主表面的第一方向上同时刚性，并且在大致平行于主表面的第二方向上是柔性的。

公开(公告)号：US20100134127A1

公开(公告)日：2010-06-03

申请号：US12478117

申请日：2009-06-04

Applicant: Keith J. Breinlinger ,  Eric D. Hobbs

Inventor： Keith J. Breinlinger ,  Eric D. Hobbs

IPC: G01R31/02

CPC classification number: G01R31/2889

Abstract: A stiffener structure, a wiring substrate, and a frame having a major surface disposed in a stack can be part of a probe card assembly. The wiring substrate can be disposed between the frame and the stiffener structure, and probe substrates can be coupled to the frame by one or more non-adjustably fixed coupling mechanisms. Each of the probe substrates can have probes that are electrically connected through the probe card assembly to an electrical interface on the wiring substrate to a test controller. The non-adjustably fixed coupling mechanisms can be simultaneously stiff in a first direction perpendicular to the major surface and flexible in a second direction generally parallel to the major surface.

Abstract translation: 加强结构，布线基板和具有设置在堆叠中的主表面的框架可以是探针卡组件的一部分。 布线基板可以设置在框架和加强件结构之间，并且探针基板可以通过一个或多个不可调节地固定的联接机构联接到框架。 每个探针基板可以具有通过探针卡组件电连接到布线基板上的电接口到测试控制器的探针。 不可调节固定的联接机构可以在垂直于主表面的第一方向上同时刚性，并且在大致平行于主表面的第二方向上是柔性的。

公开(公告)号：US07688063B2

公开(公告)日：2010-03-30

申请号：US12165325

申请日：2008-06-30

Applicant: Andrew W. McFarland ,  Kevin Youl Yasumura ,  Eric D. Hobbs ,  Keith J. Breinlinger

Inventor： Andrew W. McFarland ,  Kevin Youl Yasumura ,  Eric D. Hobbs ,  Keith J. Breinlinger

IPC: G01R31/02

CPC classification number: G01R1/44 ,  G01R1/07307 ,  G01R31/2891

Abstract: A thermal adjustment apparatus for adjusting one or more thermally induced movements of an electro-mechanical assembly includes: a compensating element expanding at a first rate different from a second rate at which the electro-mechanical assembly expands for generating a counteracting force in response to changes in temperature; and a coupling mechanism coupling the compensating element to the electro-mechanical assembly, and being adjustable to control an amount of the counteracting force applied to the electro-mechanical assembly as temperature changes.

Abstract translation: 一种用于调节机电组件的一个或多个热诱导运动的热调节装置包括：补偿元件以不同于机电组件膨胀的第二速率的第一速率膨胀以产生响应于变化的反作用力 温度; 以及将补偿元件耦合到机电组件的耦合机构，并且可调节以在温度变化时控制施加到机电组件的抵抗力的量。

公开(公告)号：US08872532B2

公开(公告)日：2014-10-28

申请号：US12979200

申请日：2010-12-27

Applicant: Keith J. Breinlinger ,  Eric D. Hobbs

Inventor： Keith J. Breinlinger ,  Eric D. Hobbs

IPC: G01R31/00 ,  G01R1/04 ,  G01R31/302

CPC classification number: G01R1/0491 ,  G01R31/3025

Abstract: Wafer cassette systems and methods of using wafer cassette systems. A wafer cassette system can include a base and a probe card assembly. The base and the probe card assembly can each include complementary interlocking alignment elements. The alignment elements can constrain relative movement of the base and probe card assembly in directions parallel to a wafer receiving surface of the base, while permitting relative movement in a direction perpendicular to the receiving surface.

Abstract translation: 晶圆盒系统和使用晶片盒系统的方法。 晶片盒系统可以包括基座和探针卡组件。 基座和探针卡组件可以各自包括互补的互锁对准元件。 对准元件可以约束基部和探针卡组件在平行于基部的晶片接收表面的方向上的相对运动，同时允许在垂直于接收表面的方向上的相对运动。

公开(公告)号：US08587331B2

公开(公告)日：2013-11-19

申请号：US12979159

申请日：2010-12-27

Applicant: Tommie E. Berry ,  Keith J. Breinlinger ,  Eric D. Hobbs ,  Marc Loranger ,  Alexander H. Slocum ,  Adrian S. Wilson

Inventor： Tommie E. Berry ,  Keith J. Breinlinger ,  Eric D. Hobbs ,  Marc Loranger ,  Alexander H. Slocum ,  Adrian S. Wilson

IPC: G01R31/00

CPC classification number: G01R31/2891

Abstract: Devices under test (DUTs) can be tested in a test system that includes an aligner and test cells. A DUT can be moved into and clamped in an aligned position on a carrier in the aligner. In the align position, electrically conductive terminals of the DUT can be in a predetermined position with respect to carrier alignment features of the carrier. The DUT/carrier combination can then be moved from the aligner into one of the test cells, where alignment features of the carrier are mechanically coupled with alignment features of a contactor in the test cell. The mechanical coupling automatically aligns terminals of the DUT with probes of the contactor. The probes thus contact and make electrical connections with the terminals of the DUT. The DUT is then tested. The aligner and each of the test cells can be separate and independent devices so that a DUT can be aligned in the aligner while other DUTs, having previously been aligned to a carrier in the aligner, are tested in a test cell.

Abstract translation: 被测设备（DUT）可以在包括对准器和测试单元的测试系统中进行测试。 DUT可以被移动并被夹持在对准器中的载体上的对准位置。 在对准位置，DUT的导电端子可以相对于载体的载体对准特征处于预定位置。 然后可以将DUT /载体组合从对准器移动到测试单元之一中，其中载体的对准特征与测试单元中的接触器的对准特征机械耦合。 机械联轴器将DUT的端子自动对准接触器的探头。 探头因此与DUT的端子接触并进行电气连接。 然后测试DUT。 对准器和每个测试单元可以是分离和独立的器件，使得DUT可以在对准器中对准，而在测试单元中测试已经与对准器中的载体对准的其它DUT。